Method for preparing resin from phenyl alkoxy silane high-boiling residue

Abstract

The invention discloses a method for preparing resin from a phenyl alkoxy silane high-boiling residue. The method comprises the following steps: step (1) pressing the phenyl alkoxy silane high-boilingresidue, a chlorosilane monomer and part of a solvent into a dropwise adding kettle by a feeding pump for later use; and step (2) adding part of the solvent, water and alcohol into a reaction kettle,dropwise adding the material in the dropwise adding kettle into the reaction kettle, and controlling the reaction temperature to be 15-55 DEG C and the dropwise adding time to be 3-8 h; stirring for1-3 h after dropwise adding is finished, standing to separate out an acid water layer, washing the silicon resin prepolymer with water for 3-6 times until the silicon resin prepolymer is neutral, filtering, evaporating a solvent, adding a catalyst for polymerization, adding the solvent, and cooling to obtain the finished product phenyl silicon resin. The product produced by the method is low in cost and high in yield; the prepared silicon resin has good heat resistance, flexibility and insulation moisture resistance, and is suitable for electric insulation paint, high-temperature-resistant paint, coil impregnating varnish and the like.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing resin from phenylalkoxysilane high boilers. Background technique [0002] Silicone materials have high refractive index, good light transmittance, good thermal stability, strong UV resistance, small internal stress, low moisture absorption, etc., and their performance is significantly better than epoxy resin, making them ideal for power LED packaging materials. Domestically, the R&D and production of power LED packaging materials are relatively backward, and most of the demand for power LED packaging materials in the domestic market depends on imports. Silicon packaging materials are the main materials and have an absolute advantage in the domestic high-end packaging market. In addition to high refractive index, light transmittance and ultraviolet radiation resistance, power LED packaging materials also require materials to have certain basic m...

AI Technical Summary

Problems solved by technology

Unreinforced vulcanizate has poor physical and mechanical properties and cannot meet the requirements, so reinforcing fillers must be added to reinforce the packaging material, but the addition of fillers can easily have a negative impact on the refractive index and light transmittance of the packaging material , which puts forward higher requirements for the selection of reinforcing fillers

[0003] Phenyl silicone resin has excellent electrical insulation, hydrophobicity, weather resistance, high temperature and low temperature resistance, radiation resistance and physiological inertness. However, most of the existing phenyl silicone resins have the following problems in the preparation process: preparation A large amount of acid wastewater is produced in the process; the preparation process is complex and cumbersome, and it is not easy to control