Packaging structure of ultraviolet light-emitting diode, packaging method thereof, and ultraviolet lamp

Abstract

The invention provides a packaging structure of an ultraviolet light-emitting diode, a packaging method thereof, and an ultraviolet lamp. The package structure of the ultraviolet light emitting diode includes: a flexible substrate, the flexible substrate includes at least a heat conduction layer, a metal conduction layer and an insulating layer stacked in sequence, and the heat conduction layer at least includes an organic material, a metal material, and an inorganic non-metallic material The formed multi-layer structure; the ultraviolet light-emitting diodes are arranged on the flexible substrate and connected to the metal conductive layer through the insulating layer; the barrier layer is arranged on the flexible substrate and covers the ultraviolet light-emitting diodes to block The layer is arranged on the flexible substrate and covers the ultraviolet light emitting diode, the light transmittance of the barrier layer is above 240nm and the absorption rate is below 1%, and the tensile strength is greater than 5Mpa. The packaging structure of the ultraviolet light-emitting diode provided by the invention has the characteristics of high light output, high thermal conductivity, low thermal resistance, and can be formed into curved surfaces and arbitrary shapes, which is beneficial to industrial application.

Description

Technical field [0001] The present invention relates to the field of packaging technology of ultraviolet light emitting diodes (LED), in particular to a UV light emitting diode packaging structure and packaging method thereof, and a UV lamp. Background [0002] Ultraviolet LED has energy saving and environmental protection and sterilization and disinfection, as well as can be used for exposure or curing characteristics, can be widely used in various occasions, but soft filament LED due to heat dissipation difference, low luminous rate, not resistant to ultraviolet rays, windability has the problem of angle limitation, the current market of ultraviolet LED generally uses bowl and cup structure of the hard material substrate (such as ceramic substrate) for packaging, single structure, non-bending, bending when the substrate is easy to break, the line is easy to disconnect, the luminous angle is small, the substrate heat conduction difference, And the application requires surface m...

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Problems solved by technology

[0002] Ultraviolet LED has the characteristics of energy saving, environmental protection, sterilization and disinfection, and can be used for exposure or curing. It can be widely used in various occasions. However, due to poor heat dissipation, the soft filament LED has low light output rate, is not resistant to ultraviolet rays, and has limited angle of winding. Problem, the UV LEDs currently on the market are generally packaged with a hard material substrate (such as a ceramic substrate) with a bowl-cup structure. The structure is single and cannot be bent. Poor, and the application needs to go through the surface mount technology (Surface Mounting Technology, SMT) soldering process, so there are almost no ultraviolet LEDs on the market that can emit light around curved surfaces

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