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Packaging structure and packaging method of optical module

An optical module and packaging method technology, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of difficult mounting cover processing, high development cost of special-shaped molds, and long development cycle. The effect of avoiding production difficulty, reducing packaging cost and reducing mold opening cost

Active Publication Date: 2021-08-27
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main purpose of the present invention is to provide a packaging structure of an optical module and its packaging method, aiming to solve the problems of high development cost of special-shaped molds, long development cycle, difficulty in mounting cover processing and many defects in the packaging method in the related art. question

Method used

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  • Packaging structure and packaging method of optical module
  • Packaging structure and packaging method of optical module
  • Packaging structure and packaging method of optical module

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0042] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0043] In addition, in t...

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Abstract

The invention discloses a packaging structure of an optical module and a packaging method thereof. Wherein, the packaging method of the optical module includes the following steps: providing a circuit substrate with a first solder joint; providing a surface mount chip with the first solder joint on the circuit substrate, and placing the chip on the backside The surface mount protective gasket of the circuit substrate; the surface of the circuit substrate provided with the chip is injection molded to form a plastic sealing layer, and the plastic sealing layer wraps the first solder joint, the chip and the protective gasket ; performing a groove operation on the surface of the plastic sealing layer facing away from the circuit substrate to expose the protective gasket and the first solder joint; mounting the photodiode on the exposed surface of the protective gasket, and Connect the electrode leads of the photodiode to the first welding spot. The technical solution of the present invention solves the problems of high development cost of special-shaped molds, long development cycle, difficult processing and many defects existing in the packaging method in the related art.

Description

technical field [0001] The invention relates to the technical field of optical modules, in particular to an optical module packaging structure and a packaging method thereof. Background technique [0002] In related technologies, the packaging methods of optical modules mainly include encapsulating chips with special-shaped molds and encapsulating chips with mounting lids. These packaging methods often have the following problems: the development cost of special-shaped molds is high, and the development cycle is long; the processing of mounting lids is difficult. Big and flawed. [0003] The above content is only used to assist in understanding the technical solution of the present invention, and does not mean that the above content is admitted as prior art. Contents of the invention [0004] The main purpose of the present invention is to provide an optical module packaging structure and its packaging method, which aims to solve the problems of high development cost of s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31H01L25/16
CPCH01L21/56H01L23/3114H01L23/3121H01L23/3135H01L23/3142H01L25/167
Inventor 王伟王文涛宋其超孙艳美孙恺汪奎
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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