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Photo-moisture curing adhesive with high-efficiency moisture barrier property and ultralow water absorption

A technology for curing resins and reactive diluents, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., which can solve the requirements of low water absorption, limited applications, and the inability of light and moisture curing technology to meet water vapor barrier Requirements and other issues, to achieve excellent heat and humidity resistance, ultra-low water absorption, high-efficiency water vapor barrier effect

Inactive Publication Date: 2020-03-17
今商科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, UV curing technology also has limitations in terms of deep layers and shadow areas of objects that are difficult to cure.
[0003] Light-moisture dual curing technology is a curing technology that combines ultraviolet (UV) curing and moisture curing methods. It can achieve deep curing and shadow surface curing, and expand the application field of ultraviolet (UV) curing systems. Curing technology cannot meet the higher water vapor barrier requirements and ultra-low water absorption requirements, so the application is still limited

Method used

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  • Photo-moisture curing adhesive with high-efficiency moisture barrier property and ultralow water absorption
  • Photo-moisture curing adhesive with high-efficiency moisture barrier property and ultralow water absorption
  • Photo-moisture curing adhesive with high-efficiency moisture barrier property and ultralow water absorption

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preparation example Construction

[0088] The preparation method of the cured resin in the present application can be any one known to those skilled in the art, such as heating and blending.

[0089] In some embodiments, the preparation method of described cured resin comprises the following steps:

[0090] a. put the polymer polyol into the reactor, and heat and dehydrate under vacuum;

[0091] b. Put in polyisocyanate after returning to normal pressure, heat and stir to react;

[0092] c. Put in hydroxyl-containing acrylate, heat and stir to react, and discharge.

[0093] The second aspect of the present invention provides a light-moisture-curing adhesive with high-efficiency moisture barrier properties and ultra-low water absorption. In parts by weight, its preparation raw materials include: 5-70 parts of the above-mentioned light-moisture-curable resin , 0-40 parts of the above-mentioned photocurable resin, 10-60 parts of reactive diluent, 0.5-10 parts of photoinitiator, and 0-20 parts of functional auxilia...

Embodiment 1

[0120] Embodiment 1 provides a kind of curing resin, and its preparation raw material comprises polymer polyol, polyisocyanate, hydroxyl-containing acrylate; The weight ratio of described polymer polyol, polyisocyanate, hydroxyl-containing acrylate is 20:2.8 :1.

[0121] The polymer polyol is hydroxyl-containing polybutadiene, the number average molecular weight is 2900, the hydroxyl functionality is 2.4, and the hydroxyl value is 46 mgKOH / g. In its molecular structure, 1,2-structure, cis-1,4 The molar ratio of -structure, trans-1,4-structure in the polymer is 1.1:2.9:1.

[0122] The polyisocyanate is hexamethylene diisocyanate; the hydroxyl-containing acrylate is hydroxyethyl methacrylate.

[0123] The raw materials for preparing the cured resin also include an antioxidant; the antioxidant is antioxidant 1010 (CAS No.: 128-37-0); the weight ratio of the antioxidant to acrylate is 0.1:1.

[0124] This example also provides the preparation method of above-mentioned cured resi...

Embodiment 2

[0130] Embodiment 2 provides a kind of curing resin, and its preparation raw material comprises polymer polyol, polyisocyanate, hydroxyl-containing acrylate; The weight ratio of described polymer polyol, polyisocyanate, hydroxyl-containing acrylate is 50:5.5 :1.

[0131] The polymer polyol is hydroxyl-containing hydrogenated polybutadiene, the number-average molecular weight is 2000, the hydroxyl functionality is 1.9, the hydroxyl value is 53.3mgKOH / g, and the double bond hydrogenation rate is 100%. In its molecular structure, 1, The molar ratio of 2-structure and 1,4-structure in the polymer is 60 / 40.

[0132] The polyisocyanate is hexamethylene diisocyanate; the hydroxyl-containing acrylate is hydroxyethyl methacrylate.

[0133] The raw materials for preparing the cured resin also include an antioxidant; the antioxidant is antioxidant 1010 (CAS No.: 128-37-0); the weight ratio of the antioxidant to acrylate is 0.25:1.

[0134] This example also provides the preparation met...

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Abstract

The invention discloses a cured resin which can be cured in a photo-moisture or light condition, and further discloses a photo-moisture curing adhesive with high-efficiency moisture barrier property and ultralow water absorption. The photo-moisture curing adhesive is prepared from the following raw materials in parts by weight: 5-70 parts of photo-moisture curing resin, 0-40 parts of photo-curingresin, 10-60 parts of a reactive diluent, 0.5-10 parts of a photoinitiator and 0-20 parts of a functional assistant. The adhesive overcomes the limitations of the ultraviolet light curing technology in the aspects that a deep layer and a shadow area are difficult to cure and the like, achieves the efficient moisture barrier property, the ultralow water absorption rate and the excellent damp-heat resistance, is suitable for application of component structure bonding, component sealing bonding protection, component potting protection, circuit board protection, welding spot bonding protection andthe like, and has wide application prospects in various industries, such as the electronic industry, the automobile industry, the aerospace industry, the national defense industry, the bioengineeringindustry and the like.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a light-moisture curing adhesive with high water vapor barrier properties and ultra-low water absorption. Background technique [0002] Ultraviolet curing technology is a curing technology that uses ultraviolet light (UV) to trigger rapid polymerization of chemically active liquid materials, and instantly solidifies to form a film or a solid adhesive layer. It has fast curing, low energy consumption, high efficiency, and no pollution. And other advantages, fully in line with the 5E principles of high efficiency, wide applicability, economy, energy saving, and environmental friendliness, it is a high-tech curing technology with high efficiency, energy saving and environmental protection. However, UV curing technology also has limitations in terms of deep layers and shadow areas of objects that are difficult to cure. [0003] Light-moisture dual curing technology is a curing technology th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C08G18/62C08G18/67C08G18/42
CPCC08G18/6204C08G18/672C09J175/14C08G18/62C08G18/42
Inventor 陈浪
Owner 今商科技(上海)有限公司
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