Thermoelectric module, hard disk device and electronic equipment
A technology for thermoelectric modules and hard disk devices, which is applied in the fields of electrical digital data processing, digital processing power distribution, and record carrier structural components, etc. Improves heat dissipation and reduces thermal crosstalk
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[0063] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, are only for explaining the present application, and should not be construed as limiting the present application.
[0064] In the description of the present application, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.
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