Texturing cleaning method and heterojunction battery
A technology of texturing and silicon wafers, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as poor texture quality, and achieve the effect of stable ozone concentration and low chemical cost
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[0042] Then the silicon wafer is oxidatively cleaned, the silicon wafer is soaked in an oxidative cleaning solution, and the cleaning solution reacts with the surface of the silicon wafer to form a uniform oxide layer of about 10 angstroms on the surface of the silicon wafer again. Specifically, there are two implementations for oxidative cleaning of silicon wafers. The first implementation includes: oxidative cleaning of silicon wafers with a mixed solution containing ozone and hydrochloric acid, and the concentration of ozone in the mixed solution containing ozone and hydrochloric acid The concentration of hydrochloric acid is 10-20PPM, the concentration of hydrochloric acid is 0.01%-0.5, the balance is deionized water, the temperature of the mixed solution is room temperature, and the reaction time is 90-180s.
[0043] The second embodiment includes: performing oxidative cleaning on the silicon wafer with a mixed solution containing potassium hydroxide and hydrogen peroxide,...
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