Method for treating chemical copper plating wastewater doing not containing hydroxyl-containing organic amine

Abstract

The invention discloses a chemical copper plating wastewater treatment method, which comprises: adjusting the pH value to 5-7, adding a ferrous chloride solution into a wastewater treatment pool, adding lime emulsion to make the pH value of the wastewater reach 10-12, co-precipitating a carboxyl-containing organic acid coordination agent or an organic phosphonic acid coordination agent and copperions by using ferrous ions and calcium ions to generate copper hydroxide precipitate, adding a flocculant to aggregate the precipitate particles, and filtering to remove the precipitate; and adding asodium hypochlorite solution to oxidize a chemical copper plating reducing agent and other organic matters, and adjusting the pH value of the wastewater to 6-9, wherein the copper treatment result meets the requirements of the table 3 in GB 21900-2008 Electroplating Pollutant Discharge Standard. According to the method of the invention, a new method for removing carboxyl-containing organic acid coordination agents, organic phosphonic acid coordination agents and copper ions in wastewater through co-precipitation with ferrous ions and calcium ions is created, so that the process is simple and easy to implement, the treatment cost is low, and good market application prospects are achieved.

Description

technical field [0001] The invention belongs to the technical field of industrial wastewater treatment, in particular to a treatment method for electroless copper plating wastewater. Background technique [0002] Electroless copper plating plays a very important role in surface treatment. The copper layers plated by different electroless copper plating solutions are all pure copper. They are mainly used in the bottom layer of non-metallic plating, metallization of printed circuit board holes, and electronic equipment. Electromagnetic shielding layer, etc. [0003] Traditional electroless copper plating generally uses carboxyl-containing organic acids as complexing agents. Electroless copper plating using organic phosphonic acids as complexing agents has been reported, but it is rarely used. Electroless copper plating wastewater contains potassium sodium tartrate, disodium ethylenediaminetetraacetic acid, sodium citrate, aminotrimethylene phosphonic acid (ATMP), 1-hydroxyeth...

AI Technical Summary

Problems solved by technology

Sodium citrate has strong oxidation resistance, and the efficiency of destroying complexing agents by traditional oxidation methods is low. Generally, a large amount of oxidizing agent is required, and the processing cost is high. It is difficult to effectively remove these complexing agents at low temperatures.

Disodium ethylenediamine tetraacetate, ATMP and HEDP have strong oxidation resistance, and these complexing agents cannot be removed by traditional oxidation methods

As far as the existing technology is used to treat electroless copper plating wastewater at present, the speed of destroying sodium citrate and tartaric acid Garner by oxidant method in winter is slow, and the treatment effect is relatively poor. Copper plating wastewater is also difficult to effectively remove copper, so the treated wastewater often does not meet the requirements of GB 21900-2008 "Electroplating Pollutant Discharge Standard"

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