LED (light emitting diode) packaging adhesive processing device

Abstract

The invention discloses an LED (light emitting diode) packaging adhesive processing device which comprises a tank body, wherein a heating cavity, a mixing cavity, a filter pressing cavity and a degassing cavity are respectively formed in the inner cavity of the tank body; a feeding tank is fixedly connected with the top of the tank body; and a feeding hopper communicates with the top of the feeding tank. The invention relates to the technical field of LED packaging adhesive processing devices. By adopting the packaging adhesive processing device, raw materials are added along with the feedinghopper, and are grinded after being fed into the feeding tank, a grinding disc is driven to rotate by a first driving motor, raw materials of an adhesive liquid fall between the grinding disc and a grinding groove, the grinding disc is rotated to grind the materials in match with the grinding groove, then remaining large-granule materials in the adhesive liquid can be crushed rapidly, and the grinding efficiency can be high; and in addition, the gap between the grinding disc and the grinding groove is fixed, only raw materials of granules small enough can fall down, so that the raw materials of the adhesive liquid have no large-granule solids, and the processed packaging adhesive is good in quality when being compared with the prior art.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation glue processing devices, in particular to an LED encapsulation glue processing device. Background technique [0002] LED encapsulant: encapsulant for high-power light-emitting diodes, with high refractive index and high light transmittance, can increase the luminous flux of LED, low viscosity, easy to defoam, suitable for potting and molding, so that LED has better durability and reliability, the addition-type liquid silicone rubber potting compound has the advantages of colorless and transparent, no low molecular by-products, small stress, deep vulcanization, no corrosion, easy control of cross-linking structure, and small shrinkage of vulcanized products; It can be vulcanized at room temperature, and can also be vulcanized by heating; after curing, the colloid has excellent properties such as thermal shock resistance, high temperature aging resistance and ultraviolet radiation resistan...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a processing device for LED encapsulation glue, which solves the problem that there are large particles of solids inside the mixed glue solution, which will lead to insufficient mixing during mixing, and the encapsulation glue is often used in the production process. There will be lumps of condensation inside, and the quantity is too large, which not only affects the production speed of the encapsulant, but also makes the quality of the produced encapsulant poor.

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