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High-temperature-resistant light-cured resin and preparation method thereof

A light-curing resin and high-temperature-resistant technology, which is applied in the direction of additive processing, can solve the problems of light-curing 3D printing technology standing still, unable to be used in large-scale production, slow light-curing reaction rate, etc., and achieve high dimensional stability, Improved bond strength and small particle size

Inactive Publication Date: 2020-01-24
威斯坦(厦门)实业有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0005] At present, the existing SLA high temperature resistant photosensitive resin has the problems of slow photocuring reaction rate, large shrinkage after complete curing, high brittleness, high water absorption rate, insufficient toughness and strength, and easy to break. At the same time, the printed parts are also easy to Bending deformation, insufficient load-bearing capacity, unable to meet market demand
Since most high temperature resistant photosensitive resins have similar problems in material properties, they cannot be used in large-scale production, which has caused the phenomenon of photo-curing 3D printing technology standing still

Method used

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  • High-temperature-resistant light-cured resin and preparation method thereof
  • High-temperature-resistant light-cured resin and preparation method thereof
  • High-temperature-resistant light-cured resin and preparation method thereof

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Experimental program
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Embodiment 1-12

[0038] The component composition of each embodiment 1-12 is shown in Table 2.

[0039] The content (mass percentage %) of various compositions in the embodiment 1-12 of table 2

[0040]

[0041]

[0042] The preparation method of the high temperature resistant photocurable resin mainly includes the following steps:

[0043] (1) Purchasing raw materials, storing and producing them at a temperature of 25°C, humidity below 40%, and dark conditions;

[0044] (2) Check whether the dispersing and emulsifying machine is clean, and whether the pipes and valves are in place;

[0045] (3) Heat each raw material in an oven at 60°C for 30 minutes to reduce the viscosity for later use;

[0046] (4) Add epoxy resin, acrylic resin and cardanol into the dispersing emulsifier in proportion, set the temperature at 60°C, 50 rpm, and stir for 2 hours;

[0047] (5) Add reactive diluent, cationic photoinitiator, free radical photoinitiator and inorganic filler in proportion to the dispersi...

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Abstract

The invention provides high-temperature-resistant light-cured resin and a preparation method thereof. The light-cured resin comprises the following components in percentage by mass: 40%-70% of epoxy resin, 5%-20% of acrylic resin, 10%-20% of an active diluent, 3%-6% of a cationic photoinitiator, 1%-3% of a free-radical photoinitiator, 5%-20% of a flexibilizer and 0.1%-3% of an inorganic filler. The high-temperature-resistant light-cured resin is high in curing reaction rate and has both toughness and strength.

Description

technical field [0001] The invention relates to the field of photocurable resin materials, in particular to a high temperature resistant photocurable resin and a preparation method thereof. Background technique [0002] 3D printing technology, also known as additive manufacturing technology, is a technology that uses computers to build three-dimensional models of objects and forms them based on them. Crossover, compared with traditional molding technology, it does not require traditional props, fixtures and multiple processing procedures. It can automatically and accurately manufacture various parts through program control on one device. 3D printing technology greatly reduces processing procedures. It obviously shortens the research and development cycle of new products and reduces the cost of research and development. It is one of the popular high-tech in modern times. [0003] Photocurable materials are obtained by photopolymerization. Photopolymerization refers to the ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F283/00C08F283/01C08K3/36C08K3/22C08L63/00C08L63/10C08L75/14C08L67/06B33Y70/10
CPCB33Y70/00C08F283/008C08F283/01C08F283/10C08F283/105C08K2003/2241C08K2201/011C08L63/00C08L2205/02C08L2205/025C08L2205/035C08L63/10C08L75/14C08L67/06C08K3/36C08K3/22
Inventor 巫国宝
Owner 威斯坦(厦门)实业有限公司
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