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Moisture-curable hot-melt adhesive agent

A hot-melt adhesive and moisture-curing technology, which is applied in the types of adhesives, polyurea/polyurethane adhesives, adhesives, etc., can solve the problems that it is difficult to prepare moisture-curing hot-melt adhesives, and achieve Excellent initial bond strength, bond strength improvement, and efficient preparation effects

Inactive Publication Date: 2020-01-14
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, it is difficult to prepare a moisture-curing hot melt adhesive with an excellent balance of various properties

Method used

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  • Moisture-curable hot-melt adhesive agent
  • Moisture-curable hot-melt adhesive agent
  • Moisture-curable hot-melt adhesive agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0179] Components (A) to (E) were mixed to prepare a moisture-curable hot melt adhesive.

[0180]Specifically, components (B1-4), (B2-1), (C3), (C4), (C5), (D1 ) and (E1) are melt mixed to prepare a molten composition.

[0181] Then, the polyester polyol (A3) and the above melting composition were mixed in the compositions shown in Table 2 (parts by weight). Place the mixture in a reaction vessel. After heating the mixture at a temperature of 130°C, the mixture was stirred at the same temperature for one hour under reduced pressure. After confirming that moisture was removed and kneading the mixture sufficiently, 4,4'-diphenylmethane diisocyanate (A5) was added thereto, and the mixture was stirred at the same temperature under reduced pressure for one hour to obtain a moisture-curable thermal Melt adhesive.

Embodiment 2-7

[0182]

[0183] Of the compositions shown in Table 2 and Table 4, components (A) to (E) were prepared in the same manner as in Example 1 to prepare a moisture-curable hot melt adhesive.

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Abstract

Provided is a moisture-curable hot-melt adhesive agent having excellent balance of initial adhesive strength, adhesive strength after curing and heat resistance and the like, and a layered product bonded with the moisture-curable hot-melt adhesive agent. Means for solving the problem: A moisture-curable hot-melt adhesive agent comprising an urethane prepolymer having an isocyanate group at the end(A), a styrene based block copolymer (B), and a tackifying resin (C), wherein the styrene based block copolymer (B) comprises a styrene based block copolymer having 10 to 35% by weight of a styrene content (B1) and a styrene based block copolymer having 40 to 70% by weight of a styrene content (B2).

Description

[0001] Cross References to Related Applications [0002] Pursuant to Article 4 of the Paris Convention, this application claims the benefit of Japanese Patent Application No. 2017-106257 filed in Japan on May 30, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a moisture-curing hot-melt adhesive. Background technique [0004] Hot-melt adhesives are used in various fields such as building interior materials (or construction material field) and electronic material field. Moisture-curing hot-melt adhesives have attracted attention from the viewpoint of being less susceptible to external factors and being easy to use for a long time. [0005] Examples of the moisture-curable hot-melt adhesive include an adhesive containing a urethane prepolymer having an isocyanate group at a terminal. Coating at least one of the substrate and the adherend (adherend) with a moisture-curable hot-melt adhesive generally i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/76C08G18/40C08G18/42C09J175/04C09J175/06C08G18/10C08G18/12
CPCC08G18/7671C08G18/10C08G18/12C08G18/4018C08G18/4202C08G18/4225C08G18/4238C09J175/06C08G2170/20C08L2205/025C09J153/02C08G18/307C08L53/02C08L75/04C08L91/00C08G18/69C08G18/6204C09J7/30C08G18/4261C08K5/01C08L23/20C08L25/08C08L75/06C08L91/06C08L93/04C08L2203/20C08L2205/035
Inventor 松田健二高森爱早川正
Owner HENKEL KGAA
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