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Moisture-curable hot melt adhesive

A hot-melt adhesive, moisture-curing technology, used in adhesives, adhesive types, ester copolymer adhesives, etc. Heat improvement effect

Inactive Publication Date: 2014-02-05
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the molecular weight of the acrylic polymer added increases, the acrylic polymer becomes less compatible with the urethane prepolymer

Method used

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  • Moisture-curable hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0057] In the case of preparing "urethane" according to the present invention, monohydric alcohol and monoisocyanate may be used, and trifunctional polyol and trifunctional isocyanate may be used as long as the target urethane prepolymer can be obtained. Preference is given to preparation using difunctional polyols (diols) and difunctional isocyanates (diisocyanates).

[0058] From the viewpoint of controlling the thermal stability of the obtained moisture-curable hot melt adhesive and the preparation method (and its preparation process), it is more preferable to prepare "urethane prepolymer" by reacting a difunctional polyol and a difunctional isocyanate . It is preferable to use 2 mol of the difunctional isocyanate based on 1 mol of the difunctional polyol because the target urethane prepolymer can be prepared relatively easily.

[0059] The moisture-curable hot-melt adhesive of the present invention is prepared by mixing the above-mentioned "urethane prepolymer" with the a...

Embodiment 1-8 and comparative example 1-4

[0192] A moisture-curable hot-melt adhesive was prepared by mixing polyol, isocyanate compound, and acrylic polymer (A) according to the composition shown in Table 2.

[0193] Specifically, a polyol and an acrylic polymer (A) were charged into a reactor, and stirred for 1 hour under reduced pressure. After removing moisture, an isocyanate compound (4,4'-diphenylmethane diisocyanate) was added at the same temperature under reduced pressure, followed by stirring for 2 hours to obtain a moisture-curable hot melt adhesive.

[0194] The values ​​of the acrylic polymer (A) disclosed in Table 2 are the values ​​after removal of the solvent (values ​​based on solid content).

[0195] Table 2 (to be continued)

[0196]

[0197] Table 2 (to be continued)

[0198]

[0199] Table 2

[0200]

[0201] In order to evaluate the initial adhesive strength of the moisture-curable hot melt adhesives in Examples and Comparative Examples, the initial peel strength was measured at each t...

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Abstract

A moisture-curable hot melt adhesive including a urethane prepolymer having an isocyanate group at the end, and an acrylic polymer (A) having an alicyclic structure, wherein the urethane prepolymer has a chemical structure derived from a crystalline polyesterpolyol. The moisture-curable hot melt adhesive is excellent in initial adhesive strength and excellent in heat resistance. The acrylic polymer (A) may be a chemical structure derived from at least one of (meth)acrylic acid derivatives selected from cyclohexyl (meth)acrylate and isobornyl (meth)acrylate.

Description

[0001] Cross-References to Related Applications [0002] This application claims the benefit of Japanese Patent Application No. 2011-116078 filed on May 24, 2011 under the Paris Convention, the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a moisture-curing hot-melt adhesive, in particular to a moisture-curing hot-melt adhesive with good initial adhesive strength and heat resistance. Background technique [0004] Moisture-curing hot melt adhesives are used in various fields such as interior building materials (or building materials) and electronic materials. A moisture-curing hot melt adhesive is an adhesive containing a urethane prepolymer having an isocyanate group at the end, and is generally an adhesive in which two parts are bonded in a hot-melt state by After the initial adhesion, cooling and solidification by coating the adhesive on the object (or the base material and the adherend), the moisture curi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C08F220/18C08G18/12C08G18/40C08G18/42C08G18/48C08G18/76C09J133/08
CPCC09J133/08C08G18/7671C08G18/4825C08G18/4238C08G18/4018C09J175/04C08G2170/20C09J175/08C08G18/12C08L33/08C08G18/307
Inventor 田母神刚吉田良夫
Owner HENKEL KGAA
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