Moisture-curable hot-melt adhesive agent
A hot-melt adhesive and moisture-curing technology, which is applied in the direction of adhesive types, rosin adhesives, polyurea/polyurethane adhesives, etc., can solve the difficult problem of preparing moisture-curing hot-melt adhesives, etc. problems, achieve excellent initial bond strength, bond strength improvement, and efficient preparation
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Embodiment 1
[0173] Components (A) to (E) were mixed to prepare a moisture-curable hot melt adhesive.
[0174] Specifically, components (B4), (B5), (C3), (C4), (C5), (D1) and (E1 ) are melt mixed to prepare a molten composition.
[0175] Then, the polyester polyol (A2) and the above melting composition were mixed in the compositions shown in Table 2 (parts by weight). Place the mixture in a reaction vessel. After heating the mixture at a temperature of 130°C, the mixture was stirred at the same temperature for one hour under reduced pressure. After confirming that moisture is removed and kneading the mixture sufficiently, 4,4'-diphenylmethane diisocyanate (A4) is added thereto, and the mixture is stirred at the same temperature under reduced pressure for one hour to obtain a moisture-curable thermal Melt adhesive.
Embodiment 2-6
[0176]
[0177] Of the compositions shown in Table 2 and Table 4, components (A) to (E) were prepared in the same manner as in Example 1 to prepare a moisture-curable hot melt adhesive.
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