High-heat-flux electronic component constant-temperature liquid cooling plate
A technology of high heat flux density and electronic components, applied in electrical components, circuits, secondary batteries, etc., can solve the problems of easy leakage of welding seam, corrosion leakage, heavy weight, etc.
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[0044] Such as Figure 1-3 As shown, a high heat flux constant temperature liquid cold plate for electronic components includes an upper cold plate 1, a liquid cooling mechanism 20 and a lower cold plate 2 stacked in sequence, and the upper cold plate 1 and the lower cold plate 2 respectively have a buckle sealing mechanism 10 The buckle sealing mechanism 10 includes a buckle flange part 11, a pressure flange part 12 and a concave cavity 13, and the upper cold plate 1 and the lower cold plate 2 are fastened to the liquid cooling mechanism through the buckle flange part 11 and the sealing ring respectively. 20 and tightened by the compression bolt 5, the pressure flange part 12 is pressed against the liquid cooling mechanism 20 through the sealing ring, so that the concave cavity of the upper cold plate and the concave cavity of the lower cold plate are combined to form a liquid-cooled The constant temperature chamber 3 on both sides of the mechanism 20 is provided with a solid...
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