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Electrolytic etching and electroplating synchronous manufacturing method for fine circuit of printed circuit board

A printed circuit board, fine circuit technology, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of high resource consumption, inconsistent with the production concept, high production cost, and achieve good circuit quality and high regularity. , the effect of improving production efficiency

Inactive Publication Date: 2019-12-31
JIANGSU BOMIN ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, both the MSAP process and the traditional three-line production process have problems such as large resource consumption and high production costs, which obviously do not conform to the current production concept of clean production and sustainable development.

Method used

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  • Electrolytic etching and electroplating synchronous manufacturing method for fine circuit of printed circuit board
  • Electrolytic etching and electroplating synchronous manufacturing method for fine circuit of printed circuit board
  • Electrolytic etching and electroplating synchronous manufacturing method for fine circuit of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] In this example, the electrolyte composition of anode chamber 1 is copper chloride dihydrate: 30g / L, hydrochloric acid: 0.48mol / L, 2,4,6-triaminopyrimidine: 90mg / L, and the electrolyte of cathode chamber 2 is Jiangsu Bomin Electronics Co., Ltd. Ltd. Tudian Potion.

[0050] Using the above electrolytic solution to carry out electrolytic etching and electroplating thickening simultaneously, such as figure 1 As shown, the electrolytic cell is divided into an anode chamber 1 and a cathode chamber 2 by a cation exchange membrane 3, the electrolyte in the anode chamber 1 is the above-mentioned electrolytic etching solution, and the electrolyte in the cathode chamber 2 is CuSO 4 ﹒ 5H 2 O, H 2 SO 4 , Cl - , inhibitor, accelerator, with the circuit board to be electrolytically etched as the anode plate 11, and the circuit board to be thickened with equal area as the cathode plate 21, at a temperature of 30°C, the current density is 3.04A / dm 2 Under certain conditions, the ...

Embodiment 2

[0053] In this example, the electrolyte composition of anode chamber 1 is copper chloride dihydrate: 30g / L, hydrochloric acid: 0.48mol / L, 2,4,6-triaminopyrimidine: 90mg / L, and the electrolyte of cathode chamber 2 is Jiangsu Bomin Electronics Co., Ltd. Ltd. Tudian Potion.

[0054] Using the above electrolytic solution to carry out electrolytic etching and electroplating thickening simultaneously, such as figure 1 As shown, the electrolytic cell is divided into an anode chamber 1 and a cathode chamber 2 by a cation exchange membrane 3, the electrolyte in the anode chamber 1 is the above-mentioned electrolytic etching solution, and the electrolyte in the cathode chamber 2 is CuSO 4 ﹒ 5H 2 O, H 2 SO 4 , Cl - , inhibitor, accelerator, with the circuit board to be electrolytically etched as the anode plate 11, and the circuit board to be thickened with the same area as the cathode plate 21, at a temperature of 23°C, the current density is 3.04A / dm 2 Under certain conditions, t...

Embodiment 3

[0057] In this example, the electrolyte composition of anode chamber 1 is copper chloride dihydrate: 20g / L, hydrochloric acid: 0.36mol / L, 2,4,6-triaminopyrimidine: 90mg / L, and the electrolyte of cathode chamber 2 is Jiangsu Bomin Electronics Co., Ltd. Ltd. Tudian Potion.

[0058] Electrolytic etching and electroplating thickening are carried out simultaneously by using the above electrolyte, combined with the device figure 1 , the electrolytic cell is divided into an anode chamber 1 and a cathode chamber 2 with a cation exchange membrane 3, the electrolyte in the anode chamber 1 is the above-mentioned electrolytic etching solution, and the electrolyte in the cathode chamber 2 is CuSO 4 ﹒ 5H 2 O, H 2 SO 4 , Cl - , inhibitor, accelerator, with the circuit board to be electrolytically etched as the anode plate 11, and the circuit board to be thickened with the same area as the cathode plate 21, at a temperature of 23°C, the current density is 3.04A / dm 2 Under certain condit...

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Abstract

The invention provides an electrolytic etching and electroplating synchronous manufacturing method for a fine circuit of a printed circuit board. The method is characterized by comprising the following steps: performing copper reduction treatment on a copper-clad substrate; carrying out surface treatment on the copper-clad substrate through a dry film pretreatment production line; pressing a layerof photoresist dry film on the pre-treated copper-clad substrate; carrying out exposure and development treatment on the copper-clad substrate, and carrying out molding to obtain a circuit board witha size required by an experiment; with an inner-layer circuit board and an outer-layer circuit board which are equal in area being used as an anode plate and a cathode plate respectively, dissolvingaway the exposed copper foil, not covered with the dry film, of the anode plate through electrochemical reaction, and depositing metal copper at the position, not covered with the dry film, of the cathode plate; and carrying out film stripping: removing the photoresist dry film covering the circuit, and carrying out cleaning and drying to obtain the required fine circuit. The prepared fine circuitof the printed circuit board is higher in regularity and good in circuit quality.

Description

technical field [0001] The invention belongs to the field of electronic production, and more specifically relates to the production of fine lines of printed circuit boards. Background technique [0002] With the rapid development of electronic communication equipment and automobile products, the printed circuit board as the carrier of components is constantly updated. In order to meet the current and signal transmission, the fine lines on the printed circuit board need to have a more regular shape, and the lines can be with greater thickness. As we all know, the production methods of fine lines of printed circuit boards mainly include subtractive method, semi-additive method and full additive method. The fine lines prepared by subtractive method have serious side erosion and extremely irregular lines. It is impossible, and the defects of the semi-additive method and the full-additive method are mainly that the bonding force between the circuit and the substrate is insuffici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10
CPCH05K3/108H05K2203/052
Inventor 文亚男陈际达付登林鲁蓝锶鄢婷邓智博张柔王旭郭海亮盛利召
Owner JIANGSU BOMIN ELECTRONICS
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