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Ceramic surface metallization process

A ceramic surface and metallization technology, applied in the field of metal ceramics, can solve the problems of complex preparation process and large energy consumption, and achieve the effect of simple process, restraining surface tension and facilitating coating

Pending Publication Date: 2019-12-13
泰州市光明电子材料有限公司
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  • Application Information

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Problems solved by technology

[0005] The above-mentioned patents use electron beam irradiation to metallize the surface of zirconia ceramics, the preparation process is complicated and the energy consumption is relatively large

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  • Ceramic surface metallization process

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0026] In this embodiment, a ceramic surface metallization process is provided, such as figure 1 shown, including the following steps:

[0027] S10 prepares the pre-sintered green body by isostatic pressing molding technology; S20 pre-sintering, placing the crucible with the pre-sintered green body in a sintering furnace at 800-900°C for low-temperature sintering to obtain the first ceramic green body; S30 processing, Carrying out mechanical processing on the first ceramic bo...

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Abstract

The invention provides a ceramic surface metallization process. The process comprises the following steps: preparing a pre-sintered green body through the isostatic pressing technology; performing pre-sintering: placing a crucible containing the pre-sintered green body into a sintering furnace with a temperature of 800-900 DEG C, and carrying out low-temperature sintering to obtain a first ceramicgreen body; performing processing: performing mechanical processing on the first ceramic green body by controlling dimensional accuracy to obtain a second ceramic green body; coating a metallizationlayer: coating the surface of the second ceramic green body with a metallization coating; and performing complete sintering: placing the third ceramic green body into a sintering furnace with a temperature of 1200-1350 DEG C for sintering to complete the ceramic surface metallization process. The ceramic surface metallization process overcomes shortcomings of the prior art, the preparation methodis simple, and a bonding strength between ceramic and a metal surface is large.

Description

technical field [0001] The invention relates to the technical field of cermets, in particular to a ceramic surface metallization process. Background technique [0002] Zirconia (ZrO 2 ) is an excellent non-metallic material because of its high hardness, high toughness, low thermal conductivity, wear resistance and corrosion resistance, and high temperature conductivity. In recent years, with the in-depth research, development and utilization of ceramic materials, the research and development and application of zirconia ceramic materials in electronic ceramics, functional ceramics and structural ceramics have developed rapidly. And the basic materials of the nuclear industry, the application in the high-tech field is extremely active. In addition, zirconia plays an important role in the development of electronics and new material industries, and its applications in metallurgy, chemical industry, glass and medicine are also increasing, and it has broad application prospects....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88C04B35/488C04B35/622
CPCC04B35/488C04B35/622C04B41/009C04B41/5144C04B41/88C04B2235/3225C04B2235/5409C04B2235/5445C04B2235/5454C04B2235/6562C04B2235/6567C04B2235/77C04B2235/96C04B41/5133C04B41/5127C04B41/5116C04B41/5138C04B41/4539C04B41/4519C04B41/0072
Inventor 包信海张翰中包信章
Owner 泰州市光明电子材料有限公司
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