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PCB ultrahigh gold wire bonding value processing method

A processing method and PCB board technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., to achieve the effect of improving production efficiency and benefits, improving gold wire bonding requirements, and solving gold wire bonding problems

Inactive Publication Date: 2019-12-10
深圳市星河电路股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Significantly improved the company's production efficiency and benefits

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  • PCB ultrahigh gold wire bonding value processing method
  • PCB ultrahigh gold wire bonding value processing method
  • PCB ultrahigh gold wire bonding value processing method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] figure 1 Schematically shows the flow chart of the PCB ultra-high gold wire bonding value processing method according to the present invention, as figure 1 As shown, this embodiment includes the following steps:

[0024] Step S100: Etching, the etching liquid is evenly sprayed onto the surface of the copper foil through the nozzle, and undergoes a redox reaction with the copper that is not protected by the etch resist, reacting the unnecessary copper...

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Abstract

The invention discloses a PCB ultrahigh gold wire bonding value processing method. The method comprises the following steps of etching, uniformly spraying etching liquid medicine to a surface of a copper foil through a spray head, carrying out a redox reaction with copper which is not protected by an etching resistance agent, reacting the unnecessary copper, exposing a base material, and carryingout film stripping treatment so as to form a line; soft gold electroplating, electroplating a layer of nickel on a PCB, and electroplating a layer of pure gold on the nickel; grinding and polishing, using a grinding tool and a dissociating abrasive to carry out micro finish machining precision on a surface of a processed workpiece, and using a soft material as the grinding tool for polishing; andgold wire bonding, connecting two welding spots of each bonding wire according to a position located by a bonding graph to achieve electrical and mechanical connection, and carrying out a bonding tension test after the bonded PCB is sealed with a glue. In the invention, a production requirement of gold wire bonding can be satisfied, a gold wire bonding requirement of the PCB can be effectively solved, product performance is improved, and the product meets a customer requirement. And company production efficiency and benefits are remarkably improved.

Description

technical field [0001] The invention relates to the technical field of PCB circuit boards, in particular to a method for processing PCBs with ultra-high bonding value of gold wires. Background technique [0002] PCB circuit board Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with gold wire or aluminum wire to the package pin or the gold-plated copper foil of the circuit board before packaging. The ultrasonic wave from the ultrasonic generator (Generally 40-140KHz), high-frequency vibration is generated by the transducer, and transmitted to the rivet through the horn. When the rivet contacts the lead wire and the welded part, under the action of pressure and vibration, the metal surface to be welded Rubbing each other, the oxide film is destroyed, and plastic deformation occurs, so that the two pure metal surfaces are in close contact, achieving the combination of atomic distance, and finally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32
CPCH05K3/32H05K2203/0307
Inventor 温沧黄江波董奇奇
Owner 深圳市星河电路股份有限公司
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