PCB ultrahigh gold wire bonding value processing method
A processing method and PCB board technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., to achieve the effect of improving production efficiency and benefits, improving gold wire bonding requirements, and solving gold wire bonding problems
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] figure 1 Schematically shows the flow chart of the PCB ultra-high gold wire bonding value processing method according to the present invention, as figure 1 As shown, this embodiment includes the following steps:
[0024] Step S100: Etching, the etching liquid is evenly sprayed onto the surface of the copper foil through the nozzle, and undergoes a redox reaction with the copper that is not protected by the etch resist, reacting the unnecessary copper...
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