A kind of substrate arrangement cache device

A cache and substrate technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting production efficiency, wasting cover plates, fragments, etc., to achieve the effect of avoiding the risk of fragmentation

Active Publication Date: 2022-04-05
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When you want to scrap this part of the substrate due to operator error, a large number of defective substrates in the previous evaporation process, or other reasons before coating the frame glue, you cannot directly open the cavity and take it out (the N2 environment is destroyed after the cavity is opened, and it will take at least one day to re-Purge Half time, seriously affecting production capacity), only the cover can be used to fit it and then discharged, or the substrate can be manually removed through the pressing device
No matter how it is done, the former wastes good covers; the latter affects production efficiency and is easy to cause fragments, which is not worth advocating.

Method used

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  • A kind of substrate arrangement cache device
  • A kind of substrate arrangement cache device
  • A kind of substrate arrangement cache device

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Experimental program
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Embodiment 1

[0039] Please refer to Figure 1 to Figure 4 , Embodiment 1 of the present invention is:

[0040] Please refer to figure 1 , a substrate buffering device 4, including a glue coating device 1, a pressing device 2, a frame glue curing device 3, a buffering device 4, an extraction device 5 and a processor;

[0041] The glue coating device 1, the pressing pair group device 2, the frame glue curing device 3 and the sheet buffer device 4 are sequentially connected and distributed in a ring (such as figure 1 and Figure 4Two kinds of distribution conditions), the glue coating device 1, the pressing pair group device 2, the frame glue curing device 3 and the sheet buffer device 4 are evenly distributed on the ring-shaped equal points, and the extraction device 5 is arranged on the The central position of the ring, the extraction device 5 includes a horizontal turntable 501 and a manipulator 502 arranged on the horizontal turntable 501, the glue coating device 1, the pressing and pa...

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Abstract

The present invention relates to the technical field of OLED packaging, and in particular to a substrate arrangement and buffer device, which is used to store abnormal substrates by setting the arrangement and buffer device, and cooperates with the processor by setting the extraction device to detect the glue coating device and the pressing pair. When there is an abnormality in the substrate in the assembly device and the frame glue curing device, the horizontal turntable is controlled to rotate to the corresponding position, and the manipulator is driven to take out the abnormal substrate and put it into the buffering device, which avoids the risk of fragmentation during the OLED packaging process, thereby improving OLED. Panel production efficiency and ensure the continuity of production.

Description

technical field [0001] The invention relates to the technical field of OLED packaging, in particular to a substrate arrangement buffer device. Background technique [0002] Organic Light-Emitting Diode (OLED) packaging equipment generally includes a conveying device connected to upstream evaporation equipment, a sealant coating device, a press-fit assembly device, and a sealant curing device. The organic materials of each layer of the OLED device are very sensitive to water vapor, oxygen and pollutants in the air, and are easy to combine with water and oxygen to cause electrochemical corrosion, which will cause damage to the OLED device and affect the life of the product. Therefore, the OLED device must be effectively packaged , to prevent water and oxygen from entering the OLED interior. [0003] When you want to scrap this part of the substrate due to operator error, a large number of defective substrates in the previous evaporation process, or other reasons before coatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/84H10K71/00
Inventor 林志斌
Owner FUJIAN HUAJIACAI CO LTD
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