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Storage type packaging structure equipped with groove and packaging method

A packaging structure and storage technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of the large size of the storage chip packaging structure and the loose connection of the PCB board. Soldering, increasing the distance, eliminating the effect of circuit failure

Inactive Publication Date: 2019-11-19
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and provide a storage type packaging structure and a packaging method provided with grooves; the invention is used to solve the problem that the volume of the storage type chip packaging structure is too large, and the connection with the PCB board is not fastened The problem

Method used

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  • Storage type packaging structure equipped with groove and packaging method
  • Storage type packaging structure equipped with groove and packaging method
  • Storage type packaging structure equipped with groove and packaging method

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Embodiment Construction

[0049] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0050] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, and therefore cannot be construed as limiting the present invention; the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be construed as indicating or implying relative importance; in addition, unless otherwise Clearly stipulated and limited, ...

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Abstract

The invention discloses a storage type packaging structure equipped with a groove and a packaging method. The packaging structure is provided with a groove structure on the basis of an existing conventional packaging carrier so that for the structures of a control chip and a memory chip on upper and lower surfaces of a packaging carrier, the control chip can be placed in the groove structure, an entire packaging product volume is reduced and the product becomes light and handy. Because the lower surface of the control chip is also in the groove, a distance between a connection point of a welding surface of the packaging carrier and the surface of the control chip is increased, which is good for firmly welding of the packaging product and a PCB. A condition that disconnection of welding points or a defect caused by the small distance between a connection point and the surface of the control chip can cause circuit impassability is eliminated.

Description

【Technical field】 [0001] The invention belongs to the field of packaging memory chips, and relates to a storage packaging structure provided with grooves and a packaging method. 【Background technique】 [0002] When packaging memory chips and control chips, the current commonly used structure and method are to place the memory chip and control chip on one side of the packaging carrier, or place the storage chip on one side of the packaging carrier, and place the control chip on the other side of the packaging carrier. The two sides of the package carrier of these two methods are all flat, so that the control chip and the memory chip all protrude from the surface of the package carrier, and the whole package structure is relatively large in overall volume; because the control chip protrudes from the surface of the package carrier , so that it is necessary to control the height of the connection point when soldering the whole structure to the PCB board, otherwise it is easy to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/56H01L23/31H01L23/492H01L23/495
CPCH01L23/3114H01L23/492H01L23/495H01L21/4821H01L21/56H01L2224/73265H01L2224/48145H01L2224/32145H01L2924/15311H01L2924/15153H01L2924/00
Inventor 王辉
Owner HUATIAN TECH XIAN
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