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Package box body structure for improving resonant frequency of superconduction quantum processor

A superconducting quantum, resonant frequency technology, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc.

Pending Publication Date: 2019-11-12
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present disclosure at least solves the following technical problems: providing a packaging box structure for increasing the resonant frequency of a superconducting quantum processor, so as to reduce or eliminate the influence of electromagnetic resonance in the packaging box of a superconducting quantum processor on the processor, and improve the superconducting quantum processor. Deriving the resonant frequency of the quantum processor

Method used

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  • Package box body structure for improving resonant frequency of superconduction quantum processor
  • Package box body structure for improving resonant frequency of superconduction quantum processor
  • Package box body structure for improving resonant frequency of superconduction quantum processor

Examples

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no. 1 example

[0030] In a first exemplary embodiment of the present disclosure, a packaging box structure for increasing the resonant frequency of a superconducting quantum processor is provided.

[0031] There are two kinds of electromagnetic resonance in the packaging box of the superconducting quantum processor: space electromagnetic wave resonance formed in the inner space of the packaging box, and L-C resonance formed by parasitic inductance and capacitance. In this embodiment, the resonance frequency (fundamental mode frequency) is increased by starting with the electromagnetic wave resonance formed in the inner space of the packaging box, so that it is raised beyond the operating frequency band (greater than the highest frequency) of the superconducting quantum processor.

[0032] figure 1 It is a schematic diagram of a space for placing a quantum processor formed by a packaging box structure according to an embodiment of the present disclosure.

[0033] refer to figure 1 As shown,...

no. 2 example

[0051] In a second exemplary embodiment of the present disclosure, a packaging box structure for increasing the resonant frequency of a superconducting quantum processor is provided.

[0052] In this embodiment, starting from the L-C resonance formed by parasitic inductance and parasitic capacitance, the resonance frequency is increased so that it is raised beyond the operating frequency band of the superconducting quantum processor.

[0053] image 3 It is a schematic structural diagram of a base for placing a quantum processor according to an embodiment of the present disclosure.

[0054] refer to image 3 As shown, the packaging box structure of the present disclosure includes: a base 4, on which a superconducting quantum processor is placed, wherein, the base 4 has a hollow area 5, and the hollow area 5 is located in the superconducting quantum processor. The device is below and adjacent to the superconducting quantum processor.

[0055] Preferably, the hollow area is f...

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Abstract

A package box body structure for improving a resonant frequency of a superconduction quantum processor comprises a base or comprises a package box body and a plurality of conductor blocks, wherein thesuperconduction quantum processor is arranged on the base, a hollow region is arranged on the base, is arranged below the superconduction quantum processor and is adjacent to the superconduction quantum processor, an accommodating space is arranged in the package box body and is used for placing the superconduction quantum processor, the size of the accommodating space in at least one direction of length, width and height is larger than the corresponding sizes of the length, the width and the height of the superconduction quantum processor so as to form a gap region, and the plurality of conductor blocks are arranged in the gap region and are contacted with an edge of the accommodating space in the package box body. The fundamental-mode frequency of an electromagnetic wave is improved bytwo ways of reducing the parasitic capacitance or reducing the effective size of a resonant cavity, so that the fundamental-mode frequency is improved to a range outside a working frequency band of the superconduction quantum processor, and the purpose of reducing or eliminating the influence of the resonant cavity on the superconduction processor is achieved.

Description

technical field [0001] The disclosure belongs to the technical field of quantum chip packaging, and relates to a packaging box structure for improving the resonant frequency of a superconducting quantum processor. Background technique [0002] In the implementation of superconducting quantum computing, connecting the quantum processor with peripheral circuits is an indispensable step. The encapsulation box of the superconducting quantum processor is the first-level device connected with the quantum processor. In the prior art, only the resonance of the air-filled part inside the sample packaging box is considered, and the spatial electromagnetic wave resonance inside the packaging box is not considered comprehensively. How to comprehensively reduce or eliminate the interference of various electromagnetic resonances inside the packaging box is a factor that must be considered in the packaging of superconducting quantum processors. Contents of the invention [0003] (1) Te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/043H01L23/10H01L23/64
CPCH01L23/043H01L23/10H01L23/642H01L23/645
Inventor 梁福田杨威风邓辉龚明吴玉林彭承志朱晓波潘建伟
Owner UNIV OF SCI & TECH OF CHINA
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