Split type heat insulation device for polycrystalline silicon thermal-field crucible and operation method thereof

Abstract

The invention discloses a split type heat insulation device for a polycrystalline silicon thermal-field crucible. The device includes a furnace body. Eight fixed blocks are fixed to the periphery sidewall in the furnace body in an equally spaced manner, with the four fixed blocks on the same plane being a group. Opposite sides of the two groups of fixed blocks are provided with first insertion slots, with the first insertion slots on the same plane being a group. A second cylinder and two first cylinders are disposed in the furnace body. Upper and lower ends of the second cylinder are provided with four second insertion slots in an equally spaced manner. The invention further provides an operation method of the split type heat insulation device for a polycrystalline silicon thermal-fieldcrucible. The device and the method solve a problem that heat insulation devices are inconvenient to disassemble and a problem that heat insulation devices are inconvenient to maintain or replace during deformation or damage, reduce the labor intensity of operators, increase the working efficiency, effectively avoid a situation that replacement of overall equipment causes an increase in the cost,and improve stability and heat insulation effects.

Description

technical field [0001] The invention relates to the technical field of semiconductor material production, in particular to a split-type heat insulation device for a multi-product silicon thermal field crucible and a method for using the same. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in consumer electronics, communication systems, medical instruments and other fields. For example, a diode is a device made of a semiconductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial application...

AI Technical Summary

Problems solved by technology

[0003] At present, when producing semiconductors, it is necessary to use a thermal field crucible to heat the semiconductor material. Due to the high temperature during heating, it is necessary to use a thermal insulation device. However, most of the existing thermal insulation devices for thermal field crucibles are fixed. It is inconvenient to disassemble. When the heat insulation device is deformed or damaged due to high temperature, the whole device needs to be repaired or replaced, which is time-consuming, labor-intensive, and costly. For this reason, we propose a multi-product Split-type heat insulation device for silicon heat field crucible and its use method to solve the above problems

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