Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-temperature-resistant adhesive-blocking release film for flexible circuit board, and preparation method and application thereof

A flexible circuit board, high temperature resistant technology, applied in the direction of chemical instruments and methods, coatings, layered products, etc., can solve the problems of increased process steps, high price, low water absorption, etc., and achieve simple preparation methods and low raw material costs , the effect of mild conditions

Inactive Publication Date: 2019-10-22
安徽屹珹新材料科技有限公司
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The 4-methylpentene polymer film (Mitsui Chemicals trade name "TPX") used in the high-end field has a high melting point, low shrinkage rate, and low water absorption rate, making it a perfect high-temperature resistant adhesive release film; but it is expensive The price hinders its wide application in FPC manufacturing enterprises
However, the silicone release film for the middle and low-end field has poor adhesive barrier function, prone to changes in surface roughness and a large amount of silicon residue, which makes it difficult to continue the later process, and cleaning the residual silicon on the surface also leads to an increase in process steps , environmental pollution and a series of problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-temperature-resistant adhesive-blocking release film for flexible circuit board, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] The present invention also provides a method for preparing the high temperature resistant adhesive release film described in the above technical solution, comprising the following steps:

[0066] a) Fully disperse, mix and filter the fluorocarbon resin, fluorine release agent and organic solvent to obtain the main agent; then compound the main agent and curing agent to obtain a fluorine release coating; the fluorine release The agent is selected from at least one of fluorine-containing polyacrylate and PTFE;

[0067] b) coating the fluorine release coating obtained in step a) on the substrate, curing, cooling and winding to obtain a high temperature resistant adhesive release film.

[0068] In the invention, firstly, the fluorocarbon resin, the fluorine release agent and the organic solvent are fully dispersed, mixed and filtered to obtain the main agent. In the present invention, the fluorocarbon resin, fluorine release agent and organic solvent are the same as those ...

Embodiment 1

[0081] (1) In 1180 parts by weight of ethyl acetate solvent, add 300 parts by weight of tetrafluoroethylene-vinyl ether copolymer (Huarin: HLR-6, ​​solid content 65%), 39 parts by weight of fluorine-containing polyacrylic acid Esters (AG: PM4800, 3M), fully dispersed, mixed and filtered to obtain the main agent of fluorine release coating.

[0082] (2) Select TPA-100 (Asahi Glass, 100% solid content) as the curing agent, add 130 parts by weight to the main agent of the fluorine release coating obtained in step (1) for compounding, and disperse at 900rpm for 20min to obtain fluorine Plain release coating.

[0083] (3) Adopt anilox coating production line, coat the fluorine release coating obtained in step (2) on the PET film (width is 1040 mm, thickness is 50 μm), set the coating thickness, wet film thickness is 30 μm, coat The line speed of the cloth production line is 10m / min; the oven length of the anilox coating production line is 30m, and there are 10 sections in total. ...

Embodiment 2

[0085](1) Add 150 parts by weight of PTFE micropowder in 500 parts by weight of methyl ethyl ketone solvent, and soak for 1h to 2h; then add 300 parts by weight of tetrafluoroethylene-vinyl ether copolymer (Hualin : HLR-6, ​​solid content 65%), after fully dispersing, mixing and filtering, the main agent of fluorine release coating is obtained.

[0086] (2) Select TPA-100 (Asahi Glass, 100% solid content) as the curing agent, add 130 parts by weight to the main agent of the fluorine release coating obtained in step (1) for compounding, and disperse at 900rpm for 20min to obtain fluorine Plain release coating.

[0087] (3) Adopt anilox coating production line, coat the fluorine release coating obtained in step (2) on the PET film (width is 1040mm, thickness is 75μm), set the coating thickness, wet film thickness is 30μm, coat The line speed of the cloth production line is 10m / min; the oven length of the anilox coating production line is 30m, and there are 10 sections in total....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
hydroxyl valueaaaaaaaaaa
Login to View More

Abstract

The invention provides a high-temperature-resistant adhesive-blocking release film for a flexible circuit board. The release film comprises a substrate and a fluorine release coating arranged on the surface of the substrate. The fluorine release coating is prepared from the following raw materials: 8 wt% to 60 wt% of fluorocarbon resin, 0.1 wt% to 30 wt% of a fluorine release agent, 0.2 wt% to 20wt% of a curing agent and 25 wt% to 90 wt% of an organic solvent, wherein the fluorine release agent is at least one selected from a group consisting of fluorine-containing polyacrylate and PTFE. Thehigh-temperature-resistant adhesive-blocking release film provided by the invention adopts the fluorine release coating with specific composition, and realizes good interaction under the condition ofa specific structure; compared with a TPX adhesive-blocking release film, the release film provided by the invention can reduce the cost of a FPC process without any influence on high temperature resistance, adhesive blocking performance and release performance; and compared with a conventional organosilicon release film, the release film provided by the invention has excellent adhesive blocking performance and is free of silicon transfer and applicable to the FPC process.

Description

technical field [0001] The present invention relates to the technical field of flexible circuit boards, and more specifically, relates to a high-temperature resistant adhesive release film for flexible circuit boards and its preparation method and application. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC) is a printed circuit board (Printed Circuit Board, PCB) with excellent flexibility made of polyimide (PI) as the base material. Features such as small size, light weight, and thin thickness can meet the current development needs of intelligent, thin, portable, and foldable terminal consumer electronics. Therefore, it has broad application prospects in many fields such as consumer electronics and automotive electronics. [0003] At present, there are few studies on the adhesive-resistant release film in the lamination process of the FPC process. The 4-methylpentene polymer film (Mitsui Chemicals trade name "TPX") used in the hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D127/18C09D133/16C08L67/02C08L23/08
CPCC09D127/18B32B27/08B32B33/00C08J2367/02C08J2427/18C08J2433/16C08J2323/08C08J7/0427C08L33/16C08L27/18
Inventor 滕超李士锋王国伟
Owner 安徽屹珹新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com