Photosensitive resin composition, dry film, and method for manufacturing printed circuit board

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of unevenness, uneven stripes, inability to uniformly coat resist material coating, etc. short circuit effect

Pending Publication Date: 2019-10-11
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventionally, when a resist material is applied to a substrate, the resist material may not be applied uniformly, resulting in uneven application.
For example, when a conventional resist material is applied to a substrate by screen printing, stripe-like unevenness may be observed in the resist layer

Method used

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  • Photosensitive resin composition, dry film, and method for manufacturing printed circuit board
  • Photosensitive resin composition, dry film, and method for manufacturing printed circuit board
  • Photosensitive resin composition, dry film, and method for manufacturing printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] According to the ratio (parts by mass) shown in Table 1, the varnish A prepared above, photopolymerization initiator, coloring agent, inorganic filler, additive, photosensitive monomer (reactive diluent), thermosetting resin, curing catalyst and The organic solvent (non-reactive diluent) was pre-mixed with a mixer, kneaded with a three-roll mill, and the viscosity was adjusted with PMA to prepare a photosensitive resin composition (solder resist composition) 1 . Regarding the contents of the three organic solvents (dipropylene glycol monomethyl ether (hereinafter also referred to as DPM), CA, and PMA) in the photosensitive resin composition 1, DPM is 20 mass parts with respect to 100 mass parts of carboxyl group-containing resin in solid content parts, CA is 54 parts by mass, and PMA is 140 parts by mass.

Embodiment 2

[0105] Except having changed the compounding ratio of each component as shown in Table 1, it carried out similarly to Example 1, and prepared the photosensitive resin composition 2. The contents of the three organic solvents (DPM, CA, PMA) in the photosensitive resin composition 2 are 25 parts by mass for DPM, 54 parts by mass for CA, and 140 parts by mass for PMA with respect to 100 parts by mass of the carboxyl group-containing resin in the solid content. parts by mass.

Embodiment 3

[0107] Except having changed the compounding ratio of each component as shown in Table 1, it carried out similarly to Example 1, and prepared the photosensitive resin composition 3. The contents of the three organic solvents (DPM, CA, PMA) in the photosensitive resin composition 3 are 20 parts by mass for DPM, 54 parts by mass for CA, and 140 parts by mass for PMA with respect to 100 parts by mass of the carboxyl group-containing resin in the solid content. parts by mass.

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PUM

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Abstract

Provided is a photosensitive resin composition, a dry film, and a method for manufacturing a printed circuit board. The photosensitive resin composition can suppress shrinkage or sagging after coatingor drying, form a uniform dry coating film after drying and can suppress a short circuit. The photosensitive resin composition of the present invention includes a carboxyl group-containing resin, a thermosetting resin, a photosensitive monomer, and an organic solvent. The organic solvent includes diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, and propylene glycolmonomethyl ether acetate.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, and particularly relates to a photosensitive resin composition suitable for solder resist formation. Moreover, this invention relates to the dry film which used this photosensitive resin composition. Moreover, this invention relates to the manufacturing method of the printed wiring board which used this photosensitive resin composition. Background technique [0002] Generally, in printed circuit boards used in electronic equipment, etc., when mounting electronic components on the printed circuit board, in order to prevent solder from adhering to unnecessary parts, the area other than the connection hole on the substrate on which the circuit pattern is formed A solder resist layer is formed. [0003] With the high precision and high density of printed circuit boards brought about by the thinner and lighter electronic equipment in recent years, it is becoming mainstream to use the fol...

Claims

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Application Information

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IPC IPC(8): G03F7/027H05K3/28
CPCG03F7/027H05K3/287
Inventor 和泉伸一郎播磨英司荒井康昭岛宫真梨子
Owner TAIYO INK MFG
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