Intermittent seal failure analysis method for sealed circuit module in high temperature environment

Abstract

The invention discloses an intermittent seal failure analysis method for a sealed circuit module in a high temperature environment. A circuit module and a rare gas are encapsulated into a cavity tool, a heating storage or power ageing experiment is performed on the encapsulated cavity tool, water vapor detection is performed on the circuit module after the experiment, whether the circuit module has high temperature intermittent seal failure is judged, qualitative analysis can be performed on a fact that whether the sealed circuit module has sealing failure and internal and external gas exchange is caused, location analysis is performed on an unqualified circuit module, a shell of the circuit module with the high temperature intermittent seal failure is cut into two parts, one part is subjected to heating storage in an air atmosphere, the other part is not treated, a pin and an insulator on the shell of the circuit module are taken out, a part, contacted with the insulator, on the shell of the circuit module is analyzed, a specific poorly-sealed failure part is found, so as to conveniently analyze a specific reason of the failure part, and a result is fed back to a manufacturer.

Description

technical field [0001] The invention belongs to the field of reliability detection of electronic components, and in particular relates to an analysis method for intermittent sealing failure of a sealed circuit module in a high-temperature environment. Background technique [0002] Various materials are used in the manufacturing process of electronic components and the assembly process is complex, which brings great challenges to the atmosphere control inside microelectronic products. During the manufacturing process of the sealed circuit module, moisture may be introduced into the substrate, filled inert gas, chip, adhesive material, soldering material, packaging process, etc. Excessive water vapor content will cause the circuit to suffer from chip electrical performance degradation, metal migration, and material corrosion failure. In addition, some failure causes are also closely related to the abnormal content of other atmospheres inside the circuit. For example, the shea...

AI Technical Summary

Problems solved by technology

At present, there is a problem among microelectronic devices: when analyzing the internal water vapor content, it is found that some microelectronic devices that have passed the sealing test contain a large amount of water vapor, oxygen, etc.

This shows that although the microelectronic device has passed the sealing leak test, there is actually a problem of poor sealing.

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