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Liquid-cooling heat dissipation device for smart phone

A liquid-cooled heat dissipation, smart phone technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of poor heat load capacity, inferior heat dissipation effect, small specific heat capacity, etc. Speed, excellent cooling effect, long service life effect

Inactive Publication Date: 2019-09-24
陈建聪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The air-cooled radiator relies on the cooling fan to make the flowing air take away heat, but the specific heat capacity of the air is small and the thermal load capacity is poor, and the heat dissipation effect is at a disadvantage compared with liquid cooling.

Method used

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  • Liquid-cooling heat dissipation device for smart phone
  • Liquid-cooling heat dissipation device for smart phone
  • Liquid-cooling heat dissipation device for smart phone

Examples

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Embodiment 1

[0019] see Figure 1-3 , the present invention provides a technical solution: a liquid-cooled heat dissipation device for a smart phone, including a liquid-cooled radiator, a small water pump 7, a water inlet pipe 6, a water outlet pipe 5, a matching joint 8, a water tank 9, an auxiliary heat-conducting material 2, and a liquid-cooled The radiator includes spring buckles 1, fins 3, cooling fan 4, porous shell 10, liquid cooling tube 11 and heat conducting metal plate 12, and the auxiliary heat conducting material 2 is installed between the liquid cooling radiator and the heating back of the mobile phone; the water inlet pipe 6 One end of the water outlet pipe 5 is respectively connected to the liquid cooling radiator, and the other end is connected to the water tank 9, and the water outlet pipe 5 is connected to the matching joint 8 on the water tank 9 through a small water pump 7. The auxiliary heat-conducting material 2 is a soft heat-conducting silica gel sheet, and a cooli...

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Abstract

The invention discloses a liquid-cooling heat dissipation device for a smart phone. The device comprises a liquid-cooling radiator, a small water pump, a water inlet pipe, a water outlet pipe, a matching joint, a water tank and an auxiliary heat conduction material. The liquid-cooling radiator comprises a spring buckle, fins, a cooling fan, a porous shell, a liquid-cooling pipe and a heat conduction metal plate, and the auxiliary heat conduction material is installed between the liquid-cooling radiator and the heating back face of the smart phone. One end of the water inlet pipe and one end of the water outlet pipe are connected to the liquid-cooling radiator, and the other end of the water inlet pipe and the other end of the water outlet pipe are connected to the water tank. The water outlet pipe is connected with the matching joint on the water tank through the small water pump. The device is simple in structure, convenient to use, high in adjustability and wide in adaptability, and effectively solves the heat dissipation problem of the smart phone.

Description

Technical field: [0001] The invention relates to the field of liquid cooling and heat dissipation, in particular to a liquid cooling and heat dissipation device for smart phones. Background technique: [0002] With the rapid development of high-performance smart phones, the heat dissipation problem of mobile phones is becoming more and more obvious. It just so happens that the high heat generation of mobile phones is a major bottleneck that restricts the release of mobile phone performance and development. However, when mobile phone manufacturers design and produce mobile phones, they do not give much consideration to the problem of high heat generation. Most mobile phones can only rely on internal graphite sheets to transfer heat to the environment through heat conduction. A small number of flagship mobile phones are equipped with micro-heat pipes. Auxiliary cooling. In order to solve the existing problems at present, it is necessary to connect an external heat sink for t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20272H05K7/20409
Inventor 陈建聪
Owner 陈建聪
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