Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Flexible circuit board manufacturing process and flexible circuit board

A technology of flexible circuit board and manufacturing process, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of unenvironmental protection of the circuit board manufacturing process, and achieve the effect of providing utilization rate, cost saving, and high degree of environmental protection

Inactive Publication Date: 2019-09-20
江门市华浦照明有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects that the production process of circuit boards in the prior art is not environmentally friendly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit board manufacturing process and flexible circuit board
  • Flexible circuit board manufacturing process and flexible circuit board
  • Flexible circuit board manufacturing process and flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] This embodiment provides a manufacturing process of a flexible circuit board, including the following steps: mixing a conductive material and a polymer material to obtain a mixture; forming a hollow part on the substrate, wherein the hollow part is consistent with the shape of the conductive circuit; laying the mixture in the hollow part; heating the substrate on which the mixture is laid, and drying the mixture.

[0040] According to the manufacturing process of the flexible circuit board provided by this embodiment, no chemical corrosion process is involved in the whole manufacturing process, so no chemical reagents are used, and the whole manufacturing process has a high degree of environmental protection and no sewage will be generated.

[0041] At the same time, compared with the traditional method of corroding after the conductive material is completely laid, the manufacturing process provided by the present invention does not involve the waste of conductive materi...

Embodiment 2

[0052] This embodiment provides a flexible circuit board, which is manufactured by the manufacturing process provided in Embodiment 1.

[0053] The flexible circuit board produced in this embodiment can be used in a light strip or in other fields, which is not limited too much in this embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a flexible circuit board manufacturing process and a flexible circuit board. The manufacturing process comprises the steps of mixing a conductive material and a high-molecular material to obtain a mixture; forming a hollowed-out part on a substrate, wherein the hollowed-out part is consistent with a conductive circuit in shape; laying the mixture in the hollowed-out part; and carrying out high-temperature heating on the substrate laid with the mixture, and drying the mixture. According to the manufacturing process provided by the invention of the flexible circuit board, the whole manufacturing process does not involve a chemical corrosion process, so that it is necessary to adopt a chemical reagent, the whole manufacturing process is high in environmental protection degree and does not produce sewage. Meanwhile, compared with the traditional process in which corrosion is carried out after the conductive material is completely laid, the manufacturing process provided by the invention does not involve the waste of the conductive material, thereby being more cost saving.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board manufacturing process and the flexible circuit board. Background technique [0002] Flexible circuit boards, also known as "soft boards", are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Up to now, flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of component assembly and wire connecti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/10
CPCH05K3/107H05K2203/1105
Inventor 吴红平何秀华
Owner 江门市华浦照明有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com