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A thermocompression joint for cof packaging and preparation method thereof

An indenter and system technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of falling off, high price, and difficult to master the manufacturing accuracy.

Active Publication Date: 2021-09-14
鋐源光电科技(厦门)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disadvantage of using a diamond or cubic boron nitride material layer embedded on a metal base is that the thermal expansion coefficients of the diamond or cubic boron nitride material and the metal base are different, so when heated and used, the expansion of the two materials is not the same. , materials with a large thermal expansion coefficient will expand and extrude in the direction of materials with a small thermal expansion coefficient. Therefore, when producing COF thermocompression joints, it is necessary to insert and weld diamond or cubic boron nitride layers on the metal base first, and then After the temperature of the entire thermocompression bonding head reaches the specified high temperature, the grinding and polishing process of the thermocompression bonding head is carried out at the specified high temperature
In addition, diamond or boron nitride materials are used as raw materials to make hot-pressed joints, and the manufacturing accuracy is not easy to grasp. Therefore, it is necessary to adjust several temperatures and measure the flatness during use. When the best flatness is achieved, the formal production will begin.
At present, there is no production technology and equipment for grinding and polishing under high temperature conditions after heating up in China. The hot-pressed joints produced in this way are completely dependent on Japanese imports, which are expensive
[0005] The disadvantage of depositing a diamond or cubic boron nitride film layer on a metal base by CVD chemical vapor deposition is that the production cost is extremely high, and the thermocompression joints produced by this method are expensive
At present, there is no relevant processing technology in China that can produce precision that meets the requirements of COF production technology. The heat-pressed joints produced in this way are completely dependent on Japanese imports.
Moreover, the CVD coating layer is very easy to peel off and fall off during high temperature use. Once the CVD coating layer peels off the coating layer, the thermocompression head will be scrapped and cannot be re-coated before use.

Method used

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  • A thermocompression joint for cof packaging and preparation method thereof

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional rela...

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Abstract

The invention provides a thermocompression bonding head for COF packaging and a preparation method thereof, wherein the thermocompression bonding head for COF packaging includes a pressure head body; one end surface of the pressure head body is a bonding surface; the thermocompression bonding head consists of Made of aluminum nitride ceramic sintered body with a purity of more than 94%. The thermocompression head provided by the invention is made of aluminum nitride ceramic sintered body with a purity of more than 94%, and can be used as a pressure head for COF packaging. The manufacturing process is simple and the cost is low.

Description

technical field [0001] The invention relates to the technical field of COF packaging, in particular to a thermocompression bonding head for COF packaging and a preparation method thereof. Background technique [0002] COF (Chip On Film) packaging of semiconductor integrated circuits, often called chip-on-chip film packaging, is a technology that fixes the driver IC on a flexible circuit board with grain soft film, and uses a soft additional circuit board as a packaged chip carrier to package the chip. Technology for bonding with flexible substrate circuits. The COF packaging process usually uses a heating head (Bonding head or Bonding tool) to heat and apply pressure to the IC and the circuit contacts or pads on the flexible film circuit board to bond the two. Because when the IC is bonded, the contacts or pads face down and are directly bonded to the contacts of the soft film without wire bonding, so it is called flip-chip packaging. [0003] The thermocompression bonding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02H01L21/56
CPCH01L21/02H01L21/56H01L21/67098H01L21/67121H01L21/67248
Inventor 贺照纲
Owner 鋐源光电科技(厦门)有限公司
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