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Silicone-based hybrid polymer-coated aln filler

A polymer and silicone technology, which is applied in the treatment of dyed organic silicon compounds, nitrogen compounds, dyed polymer organic compounds, etc., can solve the problems of complicated treatment, reduced thermal conductivity, insufficient durability, etc., and achieve long-term stable use , little change in characteristics, and high thermal conductivity

Inactive Publication Date: 2019-09-03
NIHON YAMAMURA GLASS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the adhesiveness of the coating is weak and the film quality becomes hard, cracks and interfacial peeling tend to occur on the surface, and the durability of the AlN filler against stress such as the kneading process is insufficient, making it difficult to produce a stabilized coating. protective film
[0008] Phosphoric acid-based treatment agents can form a very strong water-resistant layer on the surface of AlN fillers. However, it is very difficult to completely remove the phosphoric acid component. Use on parts in contact with metal, etc., the use is limited
[0009] As the most effective method, there is a method of using silicone oil to form a protective layer on the surface of AlN filler by high-temperature sintering. However, the processing is complicated and special, and it cannot be implemented easily. The processing cost is expensive, and there is a problem that thermal conductivity, which is an important characteristic, decreases.

Method used

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  • Silicone-based hybrid polymer-coated aln filler
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] (Preparation of liquid A-1)

[0098] As for the raw materials used, PDMS uses two-terminal silanol polydimethylsiloxane XC96-723 (number average molecular weight: Mn=680) manufactured by Momentive Co., Ltd., and TEOS oligomer uses ethyl silicate, Tama Chemical Industry Co., Ltd. Manufacture of SILICATE 40: Tetraethoxysilane linear 4-6 polymer oligomer (oligomer purity: 70% by mass, average molecular weight: 745), using tert-butanol as a diluting solvent: Wako Pure Chemical Industries Co., Ltd. / Wako special grade, using dibutyltin dilaurate as a condensation catalyst, and KS-1260 manufactured by Kyodo Pharmaceutical Co., Ltd., were synthesized on a scale of about 1 kg. The compounding quantity of each raw material is as follows.

[0099] Regarding the molar ratio, PDMS (XC96-723) is 185.6 g, TEOS oligomer (SILICATE 40) is 813.4 g, and the molar ratio of active ingredients of XC96-723 and SILICATE 40 oligomer is 1:2.8. 1.0 g of dibutyltin dilaurate was added as a conden...

Embodiment 2～4

[0109] (Preparation of A-2, 3, 4 solutions)

[0110] As for the raw materials used, PDMS uses two-terminal silanol polydimethylsiloxane XC96-723 (number average molecular weight: Mn=680) manufactured by Momentive Co., Ltd., and TEOS oligomer uses ethyl silicate, Tama Chemical Industry Co., Ltd. Manufacture of SILICATE 45: Tetraethoxysilane linear 8-10-mer oligomer (oligomer purity: 95% by mass, average molecular weight: 1282), using tert-butanol as a diluting solvent: Wako Pure Chemical Industries Co., Ltd. / Wako special grade, using dibutyltin dilaurate as a condensation catalyst, and KS-1260 manufactured by Kyodo Pharmaceutical Co., Ltd., were synthesized on a scale of about 1 kg. The compounding quantity of each raw material is as follows.

[0111] Liquid A-2: Regarding the molar ratio, PDMS (XC96-723) is 117.0g, TEOS oligomer (SILICATE 45) is 882.4g, and the molar ratio of active ingredients of XC96-723 and SILICATE 45 oligomer is 1:3.8 . 0.65 g of dibutyltin dilaurate w...

Embodiment 5

[0119] (Preparation of Solution A-5)

[0120] As for the raw materials used, PDMS uses two-terminal silanol polydimethylsiloxane DMS-S14 (number average molecular weight: Mn=1500) manufactured by Gelest Co., Ltd., and TEOS oligomer uses ethyl silicate, Tama Chemical Industry Co., Ltd. Manufacture of SILICATE 45: Tetraethoxysilane linear 8-10-mer oligomer (oligomer purity: 95% by mass, average molecular weight: 1282), using tert-butanol as a diluting solvent: Wako Pure Chemical Industries Co., Ltd. / Wako special grade, using dibutyltin dilaurate as a condensation catalyst, and KS-1260 manufactured by Kyodo Pharmaceutical Co., Ltd., were synthesized on a scale of about 1 kg. The compounding quantity of each raw material is as follows.

[0121] Regarding the molar ratio, PDMS (DMS-S14) was 226.2 g, TEOS oligomer (SILICATE 45) was 773.2 g, and the molar ratio of active ingredients of the oligomer of DMS-S14 and SILICATE 45 was 1:3.8. 0.6 g of dibutyltin dilaurate was added as a c...

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Abstract

According to the present invention, a surface-coated AlN filler for obtaining a heat-resistant heat dissipation material that is suppressed in deterioration of characteristics such as thermal conductivity due to hydrolysis of the AlN filler surface is obtained, said heat dissipation material being able to be used in a heat dissipation member that requires high thermal conduction characteristics. Asilicone-based hybrid polymer-coated AlN filler according to the present invention is mainly composed of aluminum nitride; and the surface of this filler is coated with a silicone-based hybrid polymer. If 5 g of this filler, which has an average particle diameter of 20-40 [mu]m, is added into 50 mL of an ion exchange water, the electrical conductivity of the water after being held at 121DEG C under saturated water vapor pressure for 50 hours is 350 [mu]S / cm or less.

Description

technical field [0001] The present invention relates to a filler mainly composed of aluminum nitride whose surface is covered with a silicone-based hybrid polymer (hereinafter referred to as "AlN filler"). Background technique [0002] Composite members (hereinafter referred to as "radiation members") for the purpose of heat dissipation and heat dissipation based on high thermal conductivity properties are widely used mainly in heavy electrical products and electrical products. The radiating member is composed of a composite material of fillers such as ceramics and metals having high thermal conductivity and heat-resistant resin that can impart elasticity. In recent years, with the increase in density and integration of electronic components, the required thermal conductivity has gradually increased. Among them, there are many applications requiring high electrical insulation. That is, electrical insulation and high thermal conductivity are required at the same time. In g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/40C01B21/072C09C3/10C09C3/12
CPCC01B21/072C09C1/40C09C3/10C09C3/12
Inventor 佐藤绿信藤卓也堀口恭手塚宏茂
Owner NIHON YAMAMURA GLASS CO LTD
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