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High-efficiency polishing device for machining lifting type self-control self-suction type water pump mold

A mold processing and polishing device technology, which is applied in the direction of grinding/polishing safety devices, grinding drive devices, metal processing equipment, etc., can solve the problems of unfavorable promotion and use, incomplete polishing, and small application range, so as to avoid incomplete polishing Uniformity, improved polishing degree, and energy-saving effect

Inactive Publication Date: 2019-08-30
YANGZHOU GOOD HOUSEKEEPER TECH INFORMATION CONSULTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a high-efficiency polishing device for mold processing of a lift-type self-controlling self-priming water pump, which solves the problem that the existing high-efficiency polishing device for processing molds has a small scope of application. Incomplete polishing, inconvenient use, not conducive to popularization and use

Method used

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  • High-efficiency polishing device for machining lifting type self-control self-suction type water pump mold
  • High-efficiency polishing device for machining lifting type self-control self-suction type water pump mold
  • High-efficiency polishing device for machining lifting type self-control self-suction type water pump mold

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0034] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orien...

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Abstract

The invention discloses a high-efficiency polishing device for machining a lifting type self-control self-suction type water pump mold, and relates to the technical field of water pump mold machining.The high-efficiency polishing device for machining the lifting self-control self-suction type water pump mold comprises a mounting plate, wherein one side of the mounting plate is fixedly provided with a water outlet pipe, two sides of the top end of the mounting plate are correspondingly and fixedly connected with a supporting plate, a spraying plate is fixedly connected to the top end of the supporting plate, a water inlet pipe is fixedly arranged on one side of the spraying plate, and a threaded hole is formed in the middle of the supporting plate. According to the high-efficiency polishing device for machining the lifting self-control self-suction type water pump mold, the spraying plate can be supported through the supporting plate, water can be sprayed on the surface of the mold through the spraying plate, so that the mold can be cooled; the supporting plate and a push rod can be fixed through a bidirectional nut, so that a pushing plate can be prevented from shaking, and the phenomenon that the mold is not uniformly polished can be avoided; and the distance between polishing belts can be adjusted through the push rod so as to be suitable for a plurality of different molds.

Description

technical field [0001] The invention relates to the technical field of water pump mold processing, in particular to a high-efficiency polishing device for lifting, self-controlling, and self-priming water pump mold processing. Background technique [0002] A pump is a machine that transports or pressurizes a liquid. It transmits the mechanical energy of the prime mover or other external energy to the liquid to increase the energy of the liquid. It is mainly used to transport liquids including water, oil, acid and alkali, emulsion, suspoemulsion and liquid metal. [0003] Liquids, gas mixtures and liquids containing suspended solids can also be transported. The technical parameters of pump performance include flow rate, suction lift, lift, shaft power, water power, efficiency, etc.; according to different working principles, it can be divided into volumetric pumps, vane pumps and other types. Positive displacement pumps use the change in the volume of their working chambers...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B27/00B24B55/02B24B47/16B24B41/00
CPCB24B27/0076B24B29/02B24B41/00B24B47/16B24B55/02
Inventor 王静
Owner YANGZHOU GOOD HOUSEKEEPER TECH INFORMATION CONSULTING CO LTD
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