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Device and method for reducing and homogenizing residual stresses of complex component

A residual stress and component technology, applied in the field of residual stress reduction and homogenization devices for complex components, can solve problems such as high manufacturing cost and component surface damage

Active Publication Date: 2019-08-27
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ultrasonic impact method will cause damage to the surface of the component and is not suitable for components with complex surface profiles and thin walls
The contact high-energy sound beam control method is also not suitable for components with complex contours. It needs to design a special sound wedge for coupling, and the production cost is high.

Method used

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  • Device and method for reducing and homogenizing residual stresses of complex component
  • Device and method for reducing and homogenizing residual stresses of complex component

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Embodiment Construction

[0022] Such as figure 1 As shown, the embodiment of the present application provides a liquid space array high-energy acoustic beam focused scanning reduction and homogenization device for the residual stress of complex components. It includes a closed square tank pressure vessel 100 composed of a container wall 110, a container bottom 120, and a container cover 130; a liquid medium 200 is contained in the container 100; several high-energy ultrasonic transducers 301 installed on the container wall 110 and the container bottom 120, The transmitting end of the high-energy ultrasonic transducer 301 communicates with the interior of the container 100, and the high-energy ultrasonic transducer 301 is arrayed on the container wall 110 to form a first high-energy ultrasonic transducer array 310, and is aligned on the container bottom 120 to form a second high-energy ultrasonic transducer array. Transducer array 320, the first high-energy ultrasonic transducer array 310 and the secon...

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Abstract

The invention discloses a device and method for reducing and homogenizing the residual stresses of a complex component. The complex metal or nonmetal mechanical component with residual stresses distributed on the surface and interior are placed in a liquid fluid medium or soft medium with high-energy acoustic beams; the high-energy acoustic beams generated by high-energy ultrasonic transducer arrays radiate to the surface and interior of the complex structural component; alternating dynamic stresses and residual stresses, which are applied to residual stress concentration areas by high-energyelastic waves in the component, are superposed by means of focused scanning; and when the total of the stresses is greater than the yield limit of the material, the component generates plastic deformation, and finally the residual stresses inside the component are reduced and homogenized.

Description

technical field [0001] The invention relates to the technical field of material performance research, in particular to a device and method for residual stress reduction and homogenization of complex components. Background technique [0002] For components with complex structures and high-precision processing requirements, special attention should be paid to the stress generated on the surface and inside of the workpiece during machining, casting, welding, cold processing, heat treatment, etc. If the surface and internal residual stress of the component is not properly controlled, it will be deformed or even cracked due to the release of stress during later use, thus affecting the accuracy and normal use of the component. Therefore, stress control is also a very important part in the manufacturing and service process of complex and high-precision components. Common stress reduction methods include natural aging method, vibration aging method, thermal aging method (heat treat...

Claims

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Application Information

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IPC IPC(8): C21D10/00C21D1/04
CPCC21D1/04C21D10/00Y02P10/20
Inventor 徐春广李培禄卢钰仁尹鹏李德志苗兆伟
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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