A 3D printing integrated heat sink and its application in phased array antenna

Abstract

The present invention relates to the field of heat dissipation, specifically refers to a microchannel heat sink, integrated manufacturing and its application in control array antennas. The present invention adopts 3D printing to manufacture the heat sink, and through fluid channels with gradually changing distribution, they are respectively arranged in the largest flow channels. The liquid injection port and the liquid outlet port at the smallest end allow the coolant to pass through the entire fluid channel evenly. The maximum temperature of the radiator is 298K and the minimum temperature is 295K during use. Compared with, the heat dissipation ability is stronger, the temperature distribution after heat dissipation is more uniform, and it has the characteristics of good heat dissipation and temperature uniformity, and no need to use nut sealing rings for packaging in one-time molding.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat sink, a method for manufacturing the heat sink, and a heat dissipation device for array antenna microchannels. Background technique [0002] With the development of electronic systems in the direction of miniaturization and integration, integrated multifunctional electronic systems and devices have emerged as the times require. With the improvement of the integration of various original devices, the packaging density is getting smaller and smaller, and the heat flux density of the electronic system is increasing sharply. An electronic system with small size, light weight and efficient heat dissipation is required. The main board and cooling system of the existing electronic equipment The traditional air cooling technology can no longer meet the heat dissipation requirements of high heat flux density devices. The efficient liquid cooling technology can not only meet the elec...

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Problems solved by technology

This patent uses the raised part to form a water channel for water cooling and heat exchange, but it does not consider that the flow rate of the heat exchange fluid at the inlet is large, and the pressure drop increases, which reduces the flow rate of the heat exchange fluid in the subsequent process, and the heat exchange fluid with reduced flow rate It cannot fully contact with the inside of the heat exchange container, resulting in a large "heat exchange dead volume" inside the heat exchange container. At the same time, the temperature of the heat exchange fluid rises in the second half of the fluid stroke. In the case of "thermal dead volume", the heat exchange of the whole heat exchange device is extremely uneven, without any heat exchange uniformity effect

[0008] CN200820115950.9 discloses an aluminum pass-through water-cooling heat sink. The water-cooling heat sink is processed with continuously bent water channels inside and is provided with corresponding water inlets and water outlets. As in the above reference document, only water cooling Heat transfer, without considering the uniform temperature performance of heat transfer

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