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Preparing method of UV moisture dual-cured resin

A dual-curing, resin-based technology used in adhesive types, polyurea/polyurethane adhesives, adhesives, etc., to solve problems such as low viscosity, thick adhesive layer, and shadow areas on the bonding surface

Active Publication Date: 2019-08-09
GUANGZHOU HUITIAN FINE CHEM +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a preparation method of UV moisture dual-curing resin, which has the advantages of low viscosity, strong storage stability and enhanced adhesion, and solves the problems of the traditional UV-curable resin on the bonding surface. There are shadow areas, some require a thicker adhesive layer, and some materials are even opaque, so a single UV-cured adhesive cannot meet the corresponding bonding requirements

Method used

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  • Preparing method of UV moisture dual-cured resin

Examples

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Comparison scheme
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Embodiment 1

[0025] Embodiment one: a kind of preparation method of UV moisture double curing resin, comprises the following steps:

[0026] 1) Dewater the polyester diol and polyester triol in a vacuum at 120 degrees Celsius for 4 hours, and set aside;

[0027] 2) Take 2 parts of TDI, 0.01 part of dibutyltin dilaurate, heat to 75 degrees Celsius, slowly drop in 1 part of 2000 molecular weight polycarbonate diol, and stir for 2 hours after dropping;

[0028] 3) Add 1 part of HEMA dropwise, and stir for 1 hour;

[0029] 4) Add 10 parts of diluted monomer LA, cool down to below 50 degrees Celsius, add 2 parts of TDI, very slowly drop in 1 part of polycaprolactone triol capa 3050 with a molecular weight of 500, and stir for 2 hours after dropping;

[0030] 5) Add 0.1 part of TDI, stir and defoam under vacuum to obtain a UV+moisture dual-cured pressure-sensitive resin with a viscosity of 22 Pas, an elongation at break of 70%, and a tensile strength of 5 MPa.

[0031] After adding 4% photoini...

Embodiment 2

[0032] Embodiment two: a kind of preparation method of UV moisture dual-curing resin, comprises the following steps:

[0033] 1) Dewater the polyester diol and polyester triol in a vacuum at 120 degrees Celsius for 4 hours, and set aside;

[0034] 2) Take 2 parts of IPDI, 0.1 part of dibutyltin dilaurate, heat to 75 degrees Celsius, slowly drop in 1 part of polycarbonate diol with a molecular weight of 8000, and stir for 2 hours after dropping;

[0035] 3) Add 1 part of HEMA dropwise, and stir for 1 hour;

[0036] 4) Add 10 parts of diluted monomer LA, cool down to below 50 degrees Celsius, add 2 parts of IPDI, very slowly drop in 1 part of polycaprolactone triol capa 3050 with a molecular weight of 500, and stir for 2 hours after dropping;

[0037] 5) Add 0.2 part of IPDI, stir and defoam under vacuum to prepare a UV+moisture dual-cured pressure-sensitive resin with a viscosity of 60 Pas, an elongation at break of 100%, and a tensile strength of 8 MPa.

[0038] After adding...

Embodiment 3

[0039] Embodiment three: a kind of preparation method of UV moisture dual-curing resin, comprises the following steps:

[0040] 1) Dewater the polyester diol and polyester triol in a vacuum at 120 degrees Celsius for 4 hours, and set aside;

[0041] 2) Take 2 parts of HDI and 0.1 part of catalyst, heat to 75 degrees Celsius, slowly drop into 1 part of 8000 molecular weight poly-3-methyl-1,5-pentanediol adipate, and stir for 2 hours after dropping;

[0042] 3) Add 1 part of HBMA dropwise, and stir for 1 hour;

[0043] 4) Add 10 parts of diluted monomer LA, cool down to below 50 degrees Celsius, add 2 parts of HDI, very slowly drop in 1 part of polycaprolactone triol capa 3050 with a molecular weight of 500, and stir for 2 hours after dropping;

[0044] 5) Adding 0.1 part of HDI, vacuum stirring and defoaming to obtain UV+moisture dual curing pressure-sensitive resin, the viscosity is 60 Pas, the elongation at break is 160%, and the tensile strength is 8 MPa.

[0045] After ad...

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Abstract

The invention relates to the technical field of polymer synthesis, and discloses a preparing method of UV moisture dual-cured resin. The method includes the following step of preparing 1 part of polyester glycol, 1 part of polyester triol, 4-4.5 parts of diisocyanate, 0.5-1 part of a hydroxyl monomer, 1-10 parts of a diluent monomer and 0.01-0.1 part of a catalyst. The resin prepared through the preparing method is high-strength, high-toughness and anti-ageing resin for a high-performance adhesive, the obtained UV moisture dual-cured resin has the viscosity of 20-60 Pa s, has high wettability,and can impregnate the surface of a material without being heated; after 1-5% of a photoinitiator is added, curing can be conducted at a room temperature through a UV lamp, the curing energy is 1500mj, attaching is conducted after curing, the PC shearing strength is 0.1-0.15 MPa, the instantaneous positioning effect is realized, and the PC shearing strength is 3-4 MPa 72 hours later; if the material is a light-permeable material, curing is conducted after adhesive applying and attaching, the curing energy is 3000 mj, the PC shearing strength is 1-3 MPa, and the PC shearing strength is 4-7 MPa 72 hours later.

Description

technical field [0001] The invention relates to the technical field of polymer synthesis, in particular to a preparation method of UV moisture dual-curing resin. Background technique [0002] Resin usually refers to a softening or melting range after being heated. When softening, it has a tendency to flow under the action of an external force. It is solid or semi-solid at room temperature, and sometimes it can be a liquid organic polymer. In a broad sense, it can be used as a raw material for plastic products. Any high molecular compound is called resin. [0003] UV curing has the characteristics of fast curing speed (5-30s) and no solvent, which not only meets the requirements of environmental protection, but also meets the needs of rapid production of industrial assembly lines. It is a promising adhesive curing method, but due to some There are shadow areas on the bonding surface, some require a thicker adhesive layer, and some materials are even opaque, so a single UV-cu...

Claims

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Application Information

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IPC IPC(8): C08G18/67C08G18/44C08G18/42C09J175/14
CPCC08G18/4202C08G18/4238C08G18/4277C08G18/44C08G18/672C09J175/14C08G18/42
Inventor 余越张银华程建超章锋
Owner GUANGZHOU HUITIAN FINE CHEM
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