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Bonding wire quality detection method

A quality inspection method and bonding wire technology, applied in the field of bonding wire, can solve problems such as low productivity and poor stability of the bonding process, achieve stability maintenance, reduce shutdown adjustment time, and improve productivity and work efficiency Effect

Active Publication Date: 2019-08-02
浙江佳博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, in order to solve the technical problems of low production capacity and poor stability after bonding in the prior art bonding process, the present invention provides a quality detection method for bonding wires

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] With a mass fraction of 80% gold (99.99% purity) and a mass fraction of 20% silver (99.99% purity), through smelting-rough drawing-fine drawing-ultrafine drawing-annealing-winding, the wire diameter is 23μm alloy Line, do a test.

[0030] Breaking strength and elongation test: 10 samples of the above-mentioned alloy wires that have been put into the market in different batches were selected, among which batches 7-10 were after-sales problems of varying degrees of low bonding capacity and poor stability of packaged products after they were put into the market , this embodiment is tested according to GB / T 10573 non-ferrous metal wire tensile test method, repeated 3 rounds, to obtain the average breaking strength and elongation range, as shown in Table 1, the results show that the average breaking strength is lower than 7.4Cn exists quality risk.

[0031] Table 1 Tensile test results of bonding wire samples

[0032] Sample batch 1 2 3 4 5 6 7 8 9 10 ...

Embodiment 2

[0034] Wire passing test: According to GB / T15077 precious metal and its alloy material geometric dimension measurement method, respectively select 10 different batches of bonding wire samples as described in Example 1, and conduct tests to obtain the wire passing floating range of bonding wire , as shown in Table 2, the results show that within the floating range of the line warp, there is a quality risk if the difference between the maximum value and the minimum value is greater than 0.5 μm.

[0035] Table 2 The test results of the wire passing range of the bonding wire samples

[0036] Sample batch 1 2 3 4 5 Line diameter floating range (μm) 22.7-23.2 22.8-23.2 22.8-23.1 22.7-23.1 22.9-23.3 Sample batch 6 7 8 9 10 Line diameter floating range (μm) 22.9-23.2 22.7-23.3 22.5-23.3 22.5-23.1 22.6-23.4

Embodiment 3

[0038] Stability test: get the full-axis rod (500M / axis) samples of 10 different batches of bonding wires described in Example 1 (in some embodiments, use 3000M / axis bonding wires), and use ultrasonic heating Pressure bonding equipment (KS-CONNX high-speed automatic bonding equipment), welding 200,000 wire arcs with the same length, each wire arc length is 2.5mm, the wire arcs include the wire used for burning balls, and each wire arc corresponds to For two solder joints, the welding time is 12-15 hours. The number of wire breakages and shutdown adjustment time are detected, as shown in Table 3. The results show that the bonding wire with more than 5 wire breakages and a shutdown adjustment time of more than 30 minutes has quality risks. .

[0039] Table 3 Stability test results of bonding wire samples

[0040] Sample batch 1 2 3 4 5 6 7 8 9 10 Number of disconnections 1 0 2 5 1 3 9 13 11 25 Shutdown adjustment time (min) 10 0 15 25 ...

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Abstract

The invention relates to a bonding wire quality detection method. The invention belongs to the technical field of bonding wires. The method comprises a stability test and a reliability test. The the wire arc breaking frequency of bonding of a whole wire and the time required to be adjusted by shutdown are detected; the wire arc is subjected to a tension test and a hot and cold impact test, then the stability of the bonding process is controlled, bonding wires with low quality are removed, the bonding wires with guaranteed quality are screened out and fed back to the production of the bonding wires, the process is adjusted and improved in time, and it is guaranteed that the bonding wires have a stable working state under the action of mechanical force and the extreme environment.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a method for detecting the quality of bonding wires. Background technique [0002] Bonding gold wire for semiconductor packaging is one of the basic materials in the packaging industry. It determines the development level of integrated circuits. The alloy wire required for bonding wire needs to have good mechanical strength, good ball forming characteristics, good bonding, easy operation and characteristics of welding. [0003] With the entry of advanced semiconductor packaging technology into mainland China, higher requirements have been put forward for mainland bonding gold wire manufacturers. The requirements for bonding gold wire electrical parameters, strength parameters, and ball forming parameters are getting higher and higher. Small, the conventional bonding gold wire has reached its capacity limit, and the performance requirements of the bonding wire are getting h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N33/207G01N3/08G01N3/60
CPCG01N33/207G01N3/08G01N3/60G01N2203/0017G01N2203/0067G01N2203/028
Inventor 谢海涛薛子夜赵义东
Owner 浙江佳博科技股份有限公司
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