Silk thread package dynamic contact kinetic parameter testing device and method
A dynamic parameter and testing device technology, applied in the field of mechanical dynamics, can solve the problems of destroying the quality of the wire and failing to stabilize the wire.
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[0032] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.
[0033] see figure 1 As shown, the test device for dynamic contact dynamic parameters between packages and contact rollers in the implementation of the present invention includes a power unit 1 for driving the spindle shaft (including packages) and contact rollers to rotate, and a transmission device with vibration isolation effect 2. Keep the pressure control air path with a certain contact pressure between the contact roller and the normal direction of the package 3. Maintain the vertical movement guide device of the "spindle-package-contact roller" system 4, the contact roller joint 5, the spindle and the coil Install the joint 6, the vibrating table 7 for driving the spindle shaft (including the package) to vibrate, and the support frame 8 for fixing the above-mentioned devices and parts.
[0034] see figure 2As shown, the support frame...
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