Chemical mechanical planarization device

Abstract

The invention discloses a chemical mechanical planarization device. The chemical mechanical planarization device comprises multiple rows of multiple polishing units; a transferring platform arranged on one side of the multiple rows of polishing units, at least one row of multiple loading and unloading platforms arranged between two adjacent rows of polishing units, at least one row of cleaning anddrying units parallel to the multiple rows of polishing units, a conveying unit arranged on the other side of the multiple rows of polishing units and a mechanical arm for fetching and placing wafers, wherein the transferring platform is used for holding to-be-polished wafers and cleaned and dried wafers, the loading and unloading platforms are used for temporarily holding the to-be-polished wafers and the polished wafers, the conveying unit is used for conveying the polished wafers to one side of the cleaning and drying units. The chemical mechanical planarization device simplifies the two technology steps of chemical mechanical planarization and wet process cleaning into one step and can achieve dry feeding and dry discharging of the wafers. The chemical mechanical planarization devicedoes not need the extra cleaning equipment adopted after polishing, reduces the occupied area of a purification chamber of by an independent chemical mechanical planarization device and an independentwet process cleaning device and simplifies the technological process.

Description

technical field [0001] The invention relates to the field of equipment for manufacturing semiconductor integrated circuit chips, in particular to a chemical mechanical planarization equipment. Background technique [0002] At present, in the existing semiconductor production technology field, the polishing unit and the acid tank cleaning process equipment are separated, and the polished wafers in a wet state need to be transported to the acid tank cleaning process equipment through the transmission unit, which has long strokes and high efficiency. The shortcomings of low cost and complex process constitute an obstacle to the batch planarization of wafers. At the same time, the existing separate equipment is not conducive to the intelligent transformation of the production process, and cannot coordinate the cooperation between various equipment in the processing process; the waiting time of wafers is increased in the gap between different processing processes, which further c...

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Problems solved by technology

[0002] At present, in the existing semiconductor production technology field, the polishing unit and the acid tank cleaning process equipment are separated, and the polished wafers in a wet state need to be transported to the acid tank cleaning process equipment through the transmission unit, which has long strokes and high efficiency. The shortcomings of low cost and complex process constitute an obstacle to the batch planarization of wafers

At the same time, the existing separate equipment is not conducive to the intelligent transformation of the production process, and it is impossible to coordinate the cooperation between various equipment in the processing process; the waiting time of wafers is increased in the gap between different processing processes, which further causes wafers to be broken. Increased Possibility of Contamination

Moreover, the polished wafer cannot be cleaned immediately, which further reduces the processing efficiency of the wafer, which is not conducive to industrial mass production

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