Composite vacuum deposition method of combination magnetic field, lining tapered tube and stepped tube
A technology of vacuum deposition and stepped tube, applied in vacuum evaporation plating, ion implantation plating, coating and other directions, can solve the problems of film component pollution, large particle defects, low film deposition efficiency, etc., to ensure uniformity, improve The effect of utilization efficiency
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-4 Describe this embodiment. In this embodiment, a vacuum deposition method combining a magnetic field and a lined tapered tube and a stepped tube is combined. The device used includes a bias power supply (1), an arc power supply (2), an arc ion plating target source (3 ), high-power pulsed magnetron sputtering power supply (4), high-power pulsed magnetron sputtering target source (5), bias power supply waveform oscilloscope (6), high-power pulsed magnetron sputtering power supply waveform oscilloscope (7), Waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-level magnetic field device (12), multi-level magnetic field device power supply (13), lining bias Conical tube and stepped tube combined device (14), lining bias power supply (15), sample stage (16) and vacuum chamber (17);
[0026] In this device:
[0027]The work...
specific Embodiment approach 2
[0044] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum deposition method in which the lined conical tube is combined with the stepped tube, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply is turned on (5) Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15), adjust the bias voltage of the lining bias conical tube and stepped tube combination device (14), turn on the movable coil device power supply (10) to adjust The movable coil device (9) adjusts the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the high-power pulse The period of the output pulse of the magnetron sputtering power supply (4) is an integer multiple of the output pulse of ...
specific Embodiment approach 3
[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum deposition method in which the lined tapered tube and the stepped tube are combined, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply is turned on (5) Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15), adjust the bias voltage of the lining bias conical tube and stepped tube combination device (14), turn on the movable coil device power supply (10) to adjust The movable coil device (9) adjusts the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the high-power pulse The magnetron sputtering power supply (4) outputs high-power pulses and the bias pulse waveform output by the bias power s...
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