Plasma chemical vapor deposition and magnetron sputtering or ion plating compounded plating method

Abstract

The invention relates to the technical field of new materials and modern surfaces, in particular to a plasma chemical vapor deposition and magnetron sputtering or ion plating compounded plating method. Voltage is applied to the position between a negative pole and a positive pole to enable reaction gases or inert gases to conduct glow discharging, and then plasma composed of electrons and ions is generated. Movement of the electrons is constrained by orthogonal electric field and magnetic field and limited in a certain area to conduct rotation drift movement, the collision probability of the electrons and gas atoms is enhanced, and therefore the ionization rate of the gas is enhanced; and under the combined action of the potential difference between the negative pole and the positive pole and Hall current formed by a crossed electric and magnetic field, the ions are subjected to beam extraction, and deposited on the surface of a base material directly to form a needed thin film. One important use of the compounded surface technology is to be used for preparing a high-quality diamond-like carbon film. The film has excellent performances, so the film is of great use value.

Description

technical field [0001] The invention relates to the field of new materials and modern surface technology. In particular, it relates to a plating method combining plasma chemical vapor deposition and magnetron sputtering or ion plating. Background technique [0002] Plasma Chemical Vapor Deposition (PCVD) or Plasma Enhanced Chemical Vapor Deposition (PECVD), in addition to thermal energy, also uses the excitation or excitation of an external electric field to cause gas discharge, making the gas a plasma state, and promoting chemical reactions. A type of chemical vapor deposition technique that forms a thin film on the surface of a substrate. The PCVD method can reduce the temperature of the substrate a lot, avoid the deformation or internal structure change of the substrate caused by high temperature, and facilitate the chemical reaction, making the reaction that is usually difficult to occur possible, so as to develop various composition ratios. new material. The most imp...

AI Technical Summary

Problems solved by technology

With the continuous improvement of material requirements, a single surface technology often cannot meet the needs due to certain limitations.

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