A polysilicon ingot silicon wafer cleaning equipment
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology for cleaning silicon wafers and polysilicon, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems of low cooperation between equipment, prolonging the processing time, and leaving dead angles in polishing, so as to increase the polishing contact area. , easy operation and excellent structure
Active Publication Date: 2021-02-19
安徽华顺半导体发展有限公司
View PDF8 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0004] The object of the present invention is to provide a polysilicon ingot silicon wafer cleaning equipment to solve the traditional silicon wafer processing proposed in the above background technology. The cleaning equipment and the polishing equipment belong to two types of equipment, which are processed successively, prolonging the processing time. The matching degree is low, and during the polishing process, the position of the processing box is fixed, and the polishing will leave a dead angle, resulting in the problem of incomplete polishing
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0020] see Figure 1-4 , the present invention provides a technical solution: a polycrystalline silicon ingot silicon wafer cleaning equipment, including a device main body, a lifting mechanism 2 and a cleaning mechanism 9, the device main body includes a processing box 1, a polishing rod 3, a driving machine 4, a rotating shaft 5, The inner box 6, the water collection tank 7, the pump body 8 and the legs 10, the legs 10 are arranged on the lower end surface o...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention relates to a polysilicon ingot cleaning equipment, including a processing box, a polishing rod, a driving machine, a rotating shaft, an inner box, a water collection tank, a pump body, a motor one, a pulley, a transmission shaft, a rope, a motor two, a bracket, High-pressure nozzle, slider, rack, gear and installation shaft, the rotating shaft is connected to the inside of the processing box, and is connected to the output end of the driving machine, the polishing rod is set on the rotating shaft, the inner box is located above the water collection tank, and two pulleys The symmetrical rotation is connected to the transmission shaft, the pulley is fixedly connected to the inner box through the rope, the transmission shaft is connected to the output end of the motor 1, the rack is connected to the inside of the processing box through the slider, and the gear is connected to the processing box through the installation shaft. Inside the body, the high-pressure nozzle is fixedly connected to the rack through the bracket. The invention has excellent structure, reasonable design, easy operation, eliminates dead corners of polishing, and combines polishing and cleaning into one. It has wide application prospects and strong creativity.
Description
technical field [0001] The invention relates to the field of silicon wafer cleaning equipment, in particular to a polycrystalline silicon ingot silicon wafer cleaning equipment. Background technique [0002] Silicon wafers must be strictly cleaned in the production of semiconductor devices. Trace contamination can also lead to device failure. The purpose of cleaning is to remove surface contamination impurities, including organic and inorganic substances. Some of these impurities exist in the atomic state or ion state, and some exist in the form of thin films or particles on the surface of the silicon wafer. lead to various defects. There are two ways to remove pollution, physical cleaning and chemical cleaning. [0003] Physical cleaning is one of the cleaning methods. Physical cleaning often uses high-pressure nozzles to clean silicon wafers. However, in traditional silicon wafer processing, cleaning equipment and polishing equipment belong to two types of equipment. T...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more