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Polyamic acid solution, transparent polyimide resin film and transparent substrate using same

A technology of polyamic acid and solution, which is applied in the fields of instruments, optics, photovoltaic power generation, etc. It can solve the problems of reduced thermal and mechanical properties, low transmittance in the visible light region, and no significant improvement in transmittance, and achieves high elastic modulus , low yellowness, excellent physical properties and product reliability

Active Publication Date: 2019-06-18
DOOSAN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, polyimide resin has a problem of being difficult to use in fields requiring transparency due to its low transmittance in the visible light region because of its high density of aromatic rings, which causes the color to be brown or yellow.
In order to solve this problem, a method of polymerizing by purifying monomers and solvents with high purity was tried, but the transmittance did not improve significantly
In addition, U.S. Patent No. 5,053,480 describes a method in which an aliphatic dianhydride is used instead of an aromatic dianhydride. Although the transparency and color are improved, the transmittance is not improved to a satisfactory level, and there is still heat. Problems with reduced properties and mechanical properties
As mentioned above, conventional polyimide resins still have limitations when used in fields requiring transparency

Method used

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  • Polyamic acid solution, transparent polyimide resin film and transparent substrate using same
  • Polyamic acid solution, transparent polyimide resin film and transparent substrate using same
  • Polyamic acid solution, transparent polyimide resin film and transparent substrate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] [Example 1] Production of transparent polyimide film

[0086] 1-1. Manufacture of polyamic acid solution

[0087] After charging 98.8 g of N,N'-dimethylacetamide (DMAc) into a 100 ml three-necked round bottom flask, the temperature of the flask was raised to 50°C. Thereafter, 10.0 g of 2,2'-TFDB was added to the flask, and 0.8 g of m-PDA was added 30 minutes later. This was stirred for 1 hour to completely dissolve 2,2'-TFDB and m-PDA. Then, 3.6 g of MPTA and 13.8 g of 6FDA were sequentially added to the flask, and the mixture was maintained at 50° C. and dissolved. At this time, the solid content was 20%, and the reaction was then stirred for 3 hours. After completion of the reaction between the monomers, it was left to cool to obtain a polyamic acid solution (solution viscosity at 25° C.: 96 poise (9,600 CPs)).

[0088] 1-2. Production of transparent polyimide film

[0089] After the polyamic acid solution produced in Example 1-1 was spin-coated on glass for ...

Embodiment 2

[0090] [Example 2] Production of transparent polyimide film

[0091] Use p-PDA 0.8g instead of m-PDA, and use PPTA 3.6g instead of MPTA, except that, manufacture polyamic acid solution according to the same method as Example 1-1 (solution viscosity at 25 ℃: 91 poise (9,100 CPs)).

[0092] A transparent polyimide resin film (imidization rate: 85% or more) was produced by the same method as in Example 1-2 using the above polyamic acid solution.

Embodiment 3

[0093] [Example 3] Production of transparent polyimide film

[0094] Use DMAc 98.1g, use 2,2'-TFDB 9.5g, use 4,4'-DDS1.8g instead of m-PDA, use PSHT4.3g instead of MPTA, and use 6FDA 13.2g, in addition, according to the example 1-1 A polyamic acid solution (solution viscosity at 25° C.: 75 poise (7,500 CPs)) was produced in the same manner.

[0095] A transparent polyimide resin film (imidization rate: 85% or more) was produced by the same method as in Example 1-2 using the above polyamic acid solution.

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Abstract

The invention provides a polyamic acid solution, and a transparent polyimide resin film and a transparent substrate using the same. The polyamic acid solution comprises (a) an aromatic diamine mixturecontaining (a-1) fluorinated aromatic diamine and (a-2) non-fluorinated aromatic diamine; and (b) a dianhydride mixture containing (b-1) fluorinated aromatic dianhydride and (b-2) non-fluorinated dianhydride containing ab amido group; and (c) an organic solvent. The transparent polyimide resin film and the transparent substrate produced by imidizing such a polyamic acid solution are excellent inoptical characteristics and mechanical properties, and thus can be applied to a substrate for a flexible display device.

Description

technical field [0001] The present invention relates to a polyamic acid solution applicable to a cover window for a flexible display, a protective film, a substrate, and the like, and a transparent polyimide resin film and a transparent substrate manufactured using the polyamic acid solution. Background technique [0002] Generally speaking, polyimide (polyimide, PI) resin refers to polyamic acid derivatives produced by solution polymerization (Solution polymerization) of aromatic dianhydride and aromatic diamine or aromatic diisocyanate. It is a highly heat-resistant resin produced by the imidization (Imidazation) process of ring-closing dehydration at high temperature. [0003] Such a polyimide resin is an insoluble and infusible ultra-high heat-resistant resin, which has excellent characteristics such as thermal oxidation resistance, heat resistance, radiation resistance, low temperature resistance, and chemical resistance, and is therefore widely used in Heat-resistant ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCY02E10/549C08G73/1039C08G73/1078C08G73/1064C08J5/18C08L79/08G02F1/133305C08L2201/10
Inventor 金善怜
Owner DOOSAN CORP
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