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Flexible epoxy glue and preparation method thereof

An epoxy adhesive and flexible technology, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of affecting the use and operation, and the performance degradation of epoxy cured products, so as to increase flexibility and elongation at break The effect of lifting and improving the temperature resistance

Active Publication Date: 2019-06-11
SUZHOU JINQIANG NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Below 0°C, the epoxy resin crystallizes, which will affect the use and operation; above 100°C, the performance of the epoxy cured product will drop significantly, and it cannot be placed in a high-temperature working environment for a long time

Method used

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  • Flexible epoxy glue and preparation method thereof
  • Flexible epoxy glue and preparation method thereof
  • Flexible epoxy glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] This embodiment provides a flexible epoxy glue, the flexible epoxy glue is composed of A component and B component; by mass parts, the formula of the A component is as follows:

[0055]

[0056] The formula of the B component is as follows:

[0057]

[0058]

Embodiment 2

[0060] This embodiment provides a flexible epoxy glue, the flexible epoxy glue is composed of A component and B component; by mass parts, the formula of the A component is as follows:

[0061]

[0062] The formula of the B component is as follows:

[0063]

Embodiment 3

[0065] This embodiment provides a flexible epoxy glue, the flexible epoxy glue is composed of A component and B component; by mass parts, the formula of the A component is as follows:

[0066]

[0067] The formula of the B component is as follows:

[0068]

[0069]

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PUM

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Abstract

The invention relates to a flexible epoxy glue and a preparation method thereof. The glue comprises an A component and a B component; the formula of the A component is as follows: TDI 90-100 parts, polyether 430-640 parts, epoxy resin 4000-5000 parts and silicone 40-100 parts; and the formulation of the B component is as follows: 1,3-cyclohexanebis(methylamine) 80-100 parts, propylene oxide butylether 140-170 parts, and catalyst 4 to 10 parts. According to the invention, the silicone and polyurethane modified epoxy resin are adopted, can not only increase the flexibility, improve the impact resistance and the peeling resistance, but also ensure that the epoxy resin does not crystallize at 0 DEG C. The temperature resistance and elongation at break of a cured product are greatly improved.

Description

technical field [0001] The invention relates to an epoxy glue and a preparation method thereof, in particular to a flexible epoxy glue and a preparation method thereof. Background technique [0002] At present, most domestic and foreign markets use four-functional epoxy resins or novolac epoxy resins in combination with polysulfone compounds to improve the temperature resistance of epoxy adhesives. Use a single rubber or polyurethane to add flexibility to the epoxy cure. The four-functional epoxy resin has good temperature resistance, and because it contains amino groups, it has high activity and short shelf life. Novolac epoxy resin has a limited improvement in temperature resistance, which is about 120 °C. Most of the high-temperature-resistant adhesives on the market need to be cured by heating, and the operation is cumbersome. [0003] Unmodified epoxy adhesives are generally brittle and have poor anti-stripping, impact and cracking resistance. The operating temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/08C09J11/06C09J11/08
Inventor 彭静方曹建强张军
Owner SUZHOU JINQIANG NEW MATERIALS
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