A laser electrochemical backside cooperative micromachining method and device for semiconductor materials

Abstract

The invention discloses a semiconductor material laser electrochemical back-to-back cooperative micromachining method and device, which belong to the field of special processing. To localize and enhance the conductivity of the material, form a conductive channel through which the current passes preferentially, and at the same time introduce electrolytic processing on the back of the material to realize rapid electrochemical dissolution on the back of the laser irradiation area; by controlling parameters such as laser energy, the upper surface laser scanning / Etching and electrolytic machining of the lower surface are carried out synchronously and synchronously; by controlling the time-space distribution of incident laser energy and other measures, the electrolytic machining rate of the lower surface of the material can be dynamically adjusted; the device includes a laser, an external optical circuit, an electrolytic power supply, and an electrolytic machining tank; its device The distance between cathode and anode and the space angle with the incident laser beam can be adjusted, and the bubbles generated by hydrogen evolution at the cathode can be removed in time by flushing liquid, so as to ensure stable electrochemical anodic dissolution.

Description

technical field [0001] The invention relates to a processing method and device for processing micro-slits, holes, grooves and other structures in the field of special processing, in particular to a laser electrochemical back-facing cooperative micro-processing method and device for semiconductor materials. Background technique [0002] Semiconductor materials represented by silicon and germanium have good structural and functional properties, and are widely used in chips, photovoltaics, medical devices, micro-electromechanical systems and other fields. Processing microstructures with specific morphology on the surface of semiconductor materials can achieve multiple functions, for example: submicron-scale periodic microgroove structure can enhance the anti-reflection performance of the material surface; honeycomb densely distributed smooth micropit groups can form microconcave lenses Array; the regular microstructure of the surface helps to change the hydrophilic properties o...

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Problems solved by technology

However, in this method, laser etching and electrochemical dissolution of the material occur on the same side of the material, and the energy of the incident laser beam will be affected by the electrolyte flow. At the same time, the possibility of localized processing on the back of the material has not been discussed, and the technical applicability needs to be further developed. expand

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