A gold salt adding method and system for an electroless nickel immersion gold line

Abstract

The invention provides a gold salt adding method and system for an electroless nickel immersion gold line, and the method comprises the steps: obtaining the consumption of a gold salt solution for single gold immersion through a control device according to the pre-obtained production task information which comprises the gold immersion area and thickness of a PCB to be subjected to gold immersion,and the unit number of the PCB be subjected to gold immersion on an electroless nickel immersion gold hanger; and after the PCB to be subjected to gold immersion enters a gold cylinder, the control device controls a metering pump to extract the gold salt solution of the corresponding volume from a gold salt storage tank and add the gold salt solution into the gold cylinder according to the consumption of the gold salt solution for a single process of gold immersion. By adding the gold salt solution after the PCB to be subjected to gold immersion enters the gold cylinder every time, control over repeated addition of a small amount of the gold salt solution is achieved, the concentration of the gold salt solution in the gold cylinder can be controlled to be kept within a relatively stable range, uniformity of a plating is guaranteed, the taking-out consumption of gold salt can be reduced, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method and system for adding gold salts to electroless nickel-precipitated gold wires. Background technique [0002] Under the current PCB market conditions, with the rising prices of several major PCB materials such as copper foil, copper balls, plates, and gold salts; customers continue to reduce procurement costs, resulting in negative gross profit margins for some orders. In such a severe situation, it is necessary to reduce the cost of materials and labor to increase profit margins. The cost of several main materials accounts for 60% of the PCB manufacturing cost, so reducing the cost of main materials is the most direct way to reduce the overall cost of PCB manufacturing. As one of the main materials of PCB, gold salt accounts for about 20%. Saving gold salt can directly reduce the manufacturing cost of PCB. [0003] The immersion gold process is the sur...

AI Technical Summary

Problems solved by technology

The existing supplementary method is manual supplementation. The process of gold salt collection and solution preparation takes a lot of time, resulting in a long period of supplementation, and the concentration of gold salt in the early stage of addition is high, and the consumption of the belt is large; the concentration of gold salt in the later period is small. , resulting in uneven coating thickness

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