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TADE-type silicon-containing adhesive and preparation method thereof

A technology of adhesives and organic solvents, applied in the direction of adhesives, etc., can solve the problems of high price, high cost of polyetherimide resin, unfavorable large-scale promotion and application, etc., achieve convenient operation, realize industrial production, and have good market application prospects Effect

Inactive Publication Date: 2019-05-07
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] (2) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) and other monomers are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • TADE-type silicon-containing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Put 23.0 grams (0.1 moles) of 3,3',4,4'-tetraaminodiphenyl ether (TADE) and 1300 grams of N,N dimethylformamide into the reaction kettle, stir and dissolve at room temperature, then add 19.6 grams (0.2 moles) of maleic anhydride, after stirring and dissolving, stirred and reacted at room temperature for 15 minutes, added 40.0 grams (0.1 moles) of 4,4'-bis(4-aminophenoxy) diphenyl sulfide, 20.0 grams ( 0.1 mol) 3,4'-diaminodiphenyl ether, 58.4 g (0.2 mol) 1,3-bis(3-aminophenoxy)benzene and 43.2 g (0.1 mol) 4,4'-bis(3- Aminophenoxy) diphenyl sulfone, after stirring and dissolving, add 209.3 grams (0.65 moles) of 3,3',4,4'-tetracarboxybenzophenone dianhydride, stir and dissolve at room temperature, and stir for 1.0 hours, Add 22.1 g (0.1 mole) of 3-aminopropyltriethoxysilane, stir and react at room temperature for 2 hours, and obtain 1735.6 g of viscous, transparent and homogeneous TADE-type silica gel-containing adhesive, which is designated as SA-1.

Embodiment 2

[0042] Put 23.0 g (0.1 mol) of 3,3',4,4'-tetraaminodiphenyl ether (TADE), 2200 g of N,N dimethylacetamide and 670 g of N-ethyl-2-pyrrolidone into In the reaction kettle, after stirring and dissolving at room temperature, add 19.6 grams (0.2 moles) of maleic anhydride, stir and dissolve, stir and react at room temperature for 30 minutes, then add 29.0 grams (0.1 moles) of 4,4'-diamino-4"- Hydroxytriphenylmethane, 140.0 g (0.7 mol) 3,4'-diaminodiphenyl ether, 43.2 g (0.1 mol) 4,4'-bis(4-aminophenoxy)diphenyl sulfone and 40.0 g (0.1 moles) 4,4'-bis(4-aminophenoxy)diphenyl sulfide, after stirring and dissolving, add 186.0 grams (0.6 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 193.2 grams (0.6 moles) of 3,3',4,4'-tetracarboxybenzophenone dianhydride, stirred and dissolved at room temperature, after stirring for 4.0 hours, added 44.2 grams (0.2 moles) of 3-aminopropyl triethyl Oxysilane was stirred and reacted at room temperature for 0.5 hour to obtain 3588.2 gra...

Embodiment 3

[0044] 23.0 grams (0.1 mole) of 3,3',4,4'-tetraaminodiphenyl ether (TADE), 3500 grams of N,N dimethylformamide and 2500 grams of N-ethyl-2-pyrrolidone organic Put the solvent into the reaction kettle, stir and dissolve at room temperature, add 19.6 grams (0.2 moles) of maleic anhydride, stir and dissolve, stir and react at room temperature for 25 minutes, add 240.0 grams (0.6 moles) 4,4'-bis(4 -aminophenoxy) diphenyl sulfide and 43.2 g (0.1 mole) 4,4'-bis(3-aminophenoxy) diphenyl sulfone, after stirring and dissolving, add 225.4 g (0.7 mole) 3,3' , 4,4'-tetracarboxybenzophenone dianhydride, 78.0 grams (0.15 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred at room temperature After dissolving and stirring for 2.0 hours, add 22.1 grams (0.1 moles) of 3-aminopropyltriethoxysilane and 17.9 grams (0.1 moles) of 3-aminopropyltrimethoxysilane, and stir and react at room temperature for 1.5 hours, that is Obtained 6669.2 grams of viscous transparent homog...

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Abstract

The invention relates to a TADE-type silicon-containing adhesive and a preparation method thereof. The TADE-type silicon-containing adhesive consists of a reaction product of 3,3',4,4'-tetraamino diphenyl ether (TADE), maleic anhydride, aromatic diamine, aromatic dianhydride and 3-aminopropyl trialkoxy silane, and an organic solvent. Sources of the raw materials are convenient, the process is simple, operation is convenient, and comprehensive performance of the product is good. The TADE-type silicon-containing adhesive can be applied to binding base materials of glass, ceramic, composite materials, special polar textile prepreg and composite materials of the glass, the ceramic, the composite material and the special polar textile prepreg, and a good market application prospect is achieved.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to a TADE type silica gel-containing adhesive and a preparation method thereof. Background technique [0002] Adhesive systems are widely used in various fields of the national economy: whether it is high-tech or general-purpose technology, whether it is national defense or civilian industry, or even people's daily life. [0003] There have been many research reports on adhesive systems or silicone resin systems, and there are also many invention patents: [0004] Chinese invention patent CN102786902A discloses a silicone organic fluorine epoxy adhesive and a preparation method thereof. [0005] Yan Rui, Yu Xinhai et al [Research on Preparation and Properties of New Epoxy Adhesives, Insulating Materials, 2012, 45(2): 12-14,18] disclosed a new type of epoxy resin adhesive and its preparation method, and its performance has been systematically studied. [0006] Chinese invention patent CN1...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08G73/10
Inventor 虞鑫海李智杰周志伟
Owner DONGHUA UNIV
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