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BAHPFP silicon-containing adhesive and preparation method thereof

A technology of adhesives and organic solvents, applied in the direction of adhesives, etc., can solve the problems of high cost, high price, and unfavorable large-scale application of polyetherimide resins, and achieve industrial production, convenient operation, and good market application prospects Effect

Inactive Publication Date: 2019-04-16
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] (2) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) and other monomers are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • BAHPFP silicon-containing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Put 36.6 grams (0.1 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP) and 1290 grams of N,N dimethylformamide into the reaction kettle and stir at room temperature After dissolving, add 40.0 g (0.1 mol) of 4,4'-bis(4-aminophenoxy) diphenyl sulfide, 60.0 g (0.3 mol) of 3,4'-diaminodiphenyl ether and 41.0 g (0.1 moles) 2,2-bis[4-(3-aminophenoxy)phenyl]propane, after stirring and dissolving, add 209.3 grams (0.65 moles) of 3,3',4,4'-tetracarboxybenzophenone Dianhydride, stirring and dissolving at room temperature, after stirring and reacting for 1.0 hour, add 22.1 grams (0.1 moles) of 3-aminopropyltriethoxysilane, stir and react at room temperature for 2 hours, then add 23.6 grams (0.1 moles) of γ-( 2,3-Glycidoxy)propyltrimethoxysilane was stirred and reacted at 80°C for 15 minutes to obtain 1722.6 grams of viscous, transparent and homogeneous BAHPFP-type silicone-containing adhesive, which was designated as SA-1.

Embodiment 2

[0042] 36.6 g (0.1 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP), 2000 g N,N dimethylacetamide and 960 g N-ethyl-2 - Pyrrolidone was put into the reaction kettle, stirred and dissolved at room temperature, 44.8 grams (0.2 moles) of 2-(4-aminophenyl)-5-aminobenzimidazole, 120.0 grams (0.6 moles) of 3,4'-bis Aminodiphenyl ether, 51.8 g (0.1 mol) 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and 40.0 g (0.1 mol) 4,4'-bis(4-amino Phenoxy) diphenyl sulfide, after stirring and dissolving, add 186.0 grams (0.6 moles) of 3,3',4,4'-tetracarboxy diphenyl ether dianhydride and 193.2 grams (0.6 moles) of 3,3',4 , 4'-tetracarboxybenzophenone dianhydride, stirring and dissolving at room temperature, after stirring for 4.0 hours, add 44.2 grams (0.2 moles) of 3-aminopropyltriethoxysilane, stirring and reacting at room temperature for 0.5 hours, then Add 23.6 grams (0.1 moles) of γ-(2,3-glycidyloxy)propyltrimethoxysilane, stir and react at 90°C for 15 minutes to obt...

Embodiment 3

[0044] 36.6 g (0.1 mole) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP), 4200 g N,N dimethylformamide and 1600 g N-ethyl-2 -The organic solvent of pyrrolidone is put into the reaction kettle, after stirring and dissolving at room temperature, add 160.0 grams (0.4 moles) of 4,4'-bis(4-aminophenoxy) diphenyl sulfide and 60.0 grams (0.3 moles) of 3 ,4'-diaminodiphenyl ether, after stirring and dissolving, add 225.4 grams (0.7 moles) of 3,3',4,4'-tetracarboxybenzophenone dianhydride, 78.0 grams (0.15 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride was stirred and dissolved at room temperature, and after stirring for 2.0 hours, 22.1 grams (0.1 mole) of 3-aminopropyltriethoxysilane was added And 17.9 grams (0.1 moles) of 3-aminopropyltrimethoxysilane, stirred at room temperature for 1.5 hours, then added 47.2 grams (0.2 moles) of γ-(2,3-epoxypropoxy)propyltrimethoxysilane , stirred and reacted at 85°C for 15 minutes to obtain 6447.2 grams of vis...

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Abstract

The invention relates to a BAHPFP silicon-containing adhesive and a preparation method thereof. The BAHPFP silicon-containing adhesive is composed of a reaction product of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane BAHPFP, aromatic diamine, aromatic dianhydride, 3-aminopropyl trialkoxysilane and gamma-(2,3-epoxypropoxy) propyltrimethoxysilicane and an organic solvent. The BAHPFP silicon-containing adhesive and the preparation method thereof have the advantages that the sources of raw materials are convenient, the process is simple, the operation is convenient, the comprehensive performance of the product is good, the BAHPFP silicon-containing adhesive can be applied to the adhesion of glass, ceramics, composites, special polarity textile prepreg and composite base materials, and themarket application prospect is wide.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to a BAHPFP type silica gel-containing adhesive and a preparation method thereof. Background technique [0002] Adhesive systems are widely used in various fields of the national economy: whether it is high-tech or general-purpose technology, whether it is national defense or civilian industry, or even people's daily life. [0003] There have been many research reports on adhesive systems or silicone resin systems, and there are also many invention patents: [0004] Chinese invention patent CN102786902A discloses a silicone organic fluorine epoxy adhesive and a preparation method thereof. [0005] Yan Rui, Yu Xinhai et al [Research on Preparation and Properties of New Epoxy Adhesives, Insulating Materials, 2012, 45(2): 12-14,18] disclosed a new type of epoxy resin adhesive and its preparation method, and its performance has been systematically studied. [0006] Chinese invention patent C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08G73/12
CPCC09J179/085C08G73/125
Inventor 虞鑫海鲁成明李紫璇周志伟
Owner DONGHUA UNIV
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