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BAHPP-type silicon-containing adhesive and preparation method thereof

An adhesive and organic solvent technology, applied in adhesives and other directions, can solve the problems of high price, unfavorable large-scale popularization and application, high cost of polyetherimide resin, and achieve the effect of convenient operation, good market application prospects, and industrialized production.

Inactive Publication Date: 2019-05-07
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] (2) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) and other monomers are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • BAHPP-type silicon-containing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Put 25.8 grams (0.1 moles) of 2,2-bis(3-amino-4-hydroxyphenyl)propane (BAHPP) and 1380 grams of N,N dimethylformamide into the reaction kettle, stir and dissolve at room temperature , add 120.0 g (0.3 mol) 4,4'-bis(4-aminophenoxy) diphenyl sulfide, 20.0 g (0.1 mol) 3,4'-diaminodiphenyl ether and 41.0 g (0.1 mol) 2,2-bis[4-(4-aminophenoxy)phenyl]propane, after stirring and dissolving, add 209.3 grams (0.65 moles) of 3,3',4,4'-tetracarboxybenzophenone dianhydride , stirring and dissolving at room temperature, after stirring and reacting for 1.0 hour, 22.1 grams (0.1 moles) of 3-aminopropyltriethoxysilane was added, stirred and reacted for 2 hours at room temperature, and then 23.6 grams (0.1 moles) of γ-(2, 3-Glycidoxy)propyltrimethoxysilane was stirred and reacted at 80° C. for 15 minutes to obtain 1841.8 grams of a viscous, transparent and homogeneous BAHPP-type silicone-containing adhesive, designated as SA-1.

Embodiment 2

[0042] 25.8 grams (0.1 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)propane (BAHPP), 2000 grams of N,N dimethylacetamide and 1000 grams of N-ethyl-2-pyrrolidone Put it into the reaction kettle, stir and dissolve at room temperature, add 22.4 grams (0.1 moles) of 2-(4-aminophenyl)-5-aminobenzimidazole, 100.0 grams (0.5 moles) of 3,4'-diaminobis Phenyl ether, 51.8 g (0.1 mol) 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and 120.0 g (0.3 mol) 4,4'-bis(4-aminophenoxy base) diphenyl sulfide, after stirring and dissolving, add 186.0 grams (0.6 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 193.2 grams (0.6 moles) of 3,3',4,4 '-Tetracarboxybenzophenone dianhydride was stirred and dissolved at room temperature, and after stirring for 4.0 hours, 44.2 grams (0.2 moles) of 3-aminopropyltriethoxysilane was added, stirred and reacted for 0.5 hours at room temperature, and then 23.6 gram (0.1 mole) of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, stirred and reacted at 90°C ...

Embodiment 3

[0044] 25.8 grams (0.1 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)propane (BAHPP), 5000 grams of N,N dimethylformamide and 1200 grams of N-ethyl-2-pyrrolidone Put the organic solvent in the reaction kettle, stir and dissolve at room temperature, add 280.0 grams (0.7 moles) of 4,4'-bis (4-aminophenoxy) diphenyl sulfide, stir and dissolve, add 225.4 grams (0.7 mol) 3,3',4,4'-tetracarboxybenzophenone dianhydride, 78.0 g (0.15 mol) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane Dianhydride, stirring and dissolving at room temperature, after stirring for 2.0 hours, add 22.1 grams (0.1 mole) of 3-aminopropyltriethoxysilane and 17.9 grams (0.1 mole) of 3-aminopropyltrimethoxysilane, Stir the reaction for 1.5 hours, then add 47.2 grams (0.2 moles) of γ-(2,3-glycidoxy) propyltrimethoxysilane, and stir and react at 85°C for 15 minutes to obtain 6896.4 grams of viscous, transparent and homogeneous BAHPP type Contains silicone adhesive, denoted as SA-3.

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PUM

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Abstract

The invention relates to a BAHPP-type silicon-containing adhesive and a preparation method thereof. The adhesive is composed of a product obtained through a reaction of 2,2-bis(3-amino-4-hydroxyphenyl)propane BAHPP, aromatic diamine, aromatic binary anhydride, 3-aminopropyltrialkoxysilane and gamma-(2,3-epoxypropoxy)propyltrimethoxysilane and an organic solvent. The adhesive has raw materials of convenient sources, a simple process, convenient operation and good product comprehensive performance, can be applied to bonding of glass, ceramics, composite materials, special polar textile prepreg and composite material substrates of the materials, and has good market application prospects.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to a BAHPP type silica gel-containing adhesive and a preparation method thereof. Background technique [0002] Adhesive systems are widely used in various fields of the national economy: whether it is high-tech or general-purpose technology, whether it is national defense or civilian industry, or even people's daily life. [0003] There have been many research reports on adhesive systems or silicone resin systems, and there are also many invention patents: [0004] Chinese invention patent CN102786902A discloses a silicone organic fluorine epoxy adhesive and a preparation method thereof. [0005] Yan Rui, Yu Xinhai et al [Research on Preparation and Properties of New Epoxy Adhesives, Insulating Materials, 2012, 45(2): 12-14,18] disclosed a new type of epoxy resin adhesive and its preparation method, and its performance has been systematically studied. [0006] Chinese invention patent CN...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08G73/10
Inventor 虞鑫海李智杰董浩周志伟
Owner DONGHUA UNIV
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