A heat dissipation device based on liquid metal multiphase fluid

Abstract

The invention provides a heat sink based on a liquid metal multiphase fluid. The heat sink comprises a cooling medium container, a liquid metal container, a pipeline mixer, a heat exchange device, a cooling device and a separation device, the cooling medium container is filled with a cooling medium, the liquid metal container contains a liquid metal, and the cooling medium is mixed with the liquidmetal and then introduced into the heat exchange device to cool and dissipate heat source components. The heat sink mixes the liquid metal with another cooling medium to flow to achieve heat dissipation, and the liquid metal has a lower vapor pressure and a high boiling point, and can maintain a liquid state in a wide operating temperature range when used as a coolant; under the low pumping powerconsumption, the internal circulation of the liquid-liquid two-phase flow can effectively improve the heat transfer coefficient, the liquid metal can always perform single relative flow heat exchange, thereby improving the working critical heat flow density value of a heat dissipation system, the reliability of the heat dissipation system is ensured, and the ability of the system to withstand thermal shock is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of heat dissipation, and more specifically, to a heat dissipation device based on liquid metal multiphase fluid. Background technique [0002] With the rapid development of today's microelectronics technology, the performance and integration of electronic devices have been continuously improved, resulting in a sharp increase in the heat flux of electronic devices and equipment. For example, the heat flux of today's microprocessors has reached 100W / cm 2 The order of magnitude, some high-end processors even reach 1kW / cm 2 above magnitude. The "thermal barrier" problem has become a bottleneck restricting the development of electronic devices to higher performance. Traditional air cooling and single-phase liquid cooling technologies are no longer enough to deal with this problem. Multi-phase flow heat dissipation technology is a very potential development direction in the thermal managem...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the embodiments of the present invention is to provide a heat dissipation device based on liquid metal multiphase fluid, which utilizes the characteristics of high thermal conductivity and high boiling point of liquid metal to obtain a better exchange rate by mixing liquid metal with other cooling fluids. Thermal performance to solve the problem of poor heat dissipation of the existing single working fluid and solid-liquid two-phase fluid

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