Low-junction-temperature and high-voltage-resistance GaN heterojunction field effect transistor
A heterojunction field effect, high withstand voltage technology, applied in the direction of transistors, electric solid-state devices, semiconductor devices, etc., can solve problems such as damage to connecting die wires, accelerated electromigration, reliability issues, etc., to speed up heat dissipation and reduce Effect of peak electric field, improved efficiency and linearity
Active Publication Date: 2019-04-23
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF4 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Self-heating effects can accelerate electromigration, degrade the gate, and can damage the wires connecting the die to the package case, causing a series of reliability problems
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] The technical solution of the present invention has been described in detail in the part of the content of the invention, and will not be repeated here.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to a power semiconductor technology, in particular to a low-junction-temperature and high-voltage-resistance GaN heterojunction field effect transistor. According to the low-junction-temperature and high-voltage-resistance GaN heterojunction field effect transistor provided by the invention, an AlN region is mainly inserted into a barrier layer to reduce a channel peak valveelectric field, so that the aims of increasing the voltage resistance and reducing the heat dissipation are realized. Furthermore, AlN with a good heat-conducting property is used as a passivation layer of a device, so that the current collapse is favorably inhibited and the effect of accelerating heat dissipation is also realized. The low-junction-temperature and high-voltage-resistance GaN heterojunction field effect transistor has the excellent effects that reverse voltage resistance of the device is improved, output properties of the device are improved and the channel temperature of the device is reduced, so that dangers caused by the current collapse and a self-heating effect are inhibited. The invention is especially applicable to the GaN heterojunction field effect transistor witha high-voltage-resistance capability and low channel temperature.
Description
technical field [0001] The invention belongs to the technical field of power semiconductors, and relates to a GaN heterojunction field effect transistor with low junction temperature and high withstand voltage. Background technique [0002] With the advancement of science and technology, the demand for electric energy in human society is increasing day by day. How to efficiently use electric energy has become a problem that has to be considered at present. At present, almost all electrical energy must be converted by power semiconductor devices before it can be used by electronic equipment. As one of the foundation and core technologies of new energy and energy conservation and emission reduction, power semiconductor technology has effectively promoted the application of electric energy in a more efficient, energy-saving and environmentally friendly manner. In recent years, with the rise of new energy vehicles and other fields, power semiconductor technology has a broader a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More
IPC IPC(8): H01L29/06H01L29/10H01L29/20H01L29/778H01L23/373
CPCH01L23/3738H01L29/0615H01L29/0684H01L29/1029H01L29/2003H01L29/7787
Inventor 陈万军李佳肖立杨李茂林信亚杰施宜军
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com