Device and method for improving bonding performance of polyimide substrate actuator by using low-temperature plasma

Abstract

Disclosed is a device for improving the bonding performance of a polyimide substrate actuator by using low-temperature plasma, comprising: a high-voltage DC power supply (101), a DC voltage power supply output terminal (102), an insulating handle (103), a first insulator ( 104), second insulator (105), third insulator (106), fourth insulator (107), fifth insulator (108), discharge anode (109), pulley (110), cathode metal plate (111), slide track (112) and plasma discharge area (113). It also provides the specific operation process for the surface treatment of the actuator. The surface of the plasma actuator is impacted and modified by the plasma, and the bonding characteristics of the actuator are improved and strengthened. After repeated operations several times, a polyimide dielectric barrier discharge plasma actuator with excellent bonding characteristics is produced. . Using this method can greatly improve the adhesion of the plasma actuator.

Description

technical field [0001] The invention relates to a surface modification device and a modification method for improving the bonding performance of a polyimide dielectric barrier discharge plasma actuator, which belongs to the field of plasma technology and relates to engineering and technical fields such as material surface modification and electrical insulation materials . Background technique [0002] Plasma flow control is a new concept active flow control technology based on plasma excitation, which is characterized by reducing the flight resistance by improving the flow field on the surface of the aircraft wing, improving the maneuverability and stability of the aircraft, compared with the traditional passive The advantages of the flow control method include simple structure, no moving parts, and wide operating frequency range. At present, the most commonly used method in plasma flow control is surface dielectric barrier discharge, and its actuator is also called "plasma...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is: in order to solve the shortcoming of poor bonding of existing polyimide dielectric barrier discharge plasma actuators, a device for improving the bonding performance of polyimide substrate actuators by using low-temperature plasma is provided, Including high-voltage DC power supply 101, DC voltage power supply output terminal 102, insulating handle 103, first insulator 104, second insulator 105, third insulator 106, fourth insulator 107, fifth insulator 108, discharge anode 109, pulley 110, cathode Metal plate 111, slideway 112 and plasma discharge area 113; Wherein

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