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Negative expansion memory alloy and preparation method thereof

A memory alloy and negative expansion technology, which is applied in the field of shape memory alloys, can solve the problems of thermal expansion, mutual extrusion, and failure of metal structural parts, and achieve the effect of thermal expansion, large negative expansion coefficient, and strong controllability

Active Publication Date: 2019-04-02
INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a negative expansion memory alloy to solve the problem of thermal expansion, mutual extrusion and failure of traditional metal structural parts in the service environment

Method used

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  • Negative expansion memory alloy and preparation method thereof
  • Negative expansion memory alloy and preparation method thereof
  • Negative expansion memory alloy and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] A method for preparing an alloy with negative thermal expansion, comprising the following steps:

[0044] 1) Weigh block raw materials according to atomic percentage Ni47.5%, Ti44.1%, Nb9.3%. Among them, the purity of Ni and Nb is greater than 99.9%, and the purity of Ti is greater than 99.8%;

[0045] 2) A certain ratio of raw materials is smelted 4 times in a water-cooled copper crucible to obtain an ingot weighing about 15kg;

[0046] 3) The cast ingot was homogenized and annealed in vacuum at 900°C for 4 hours;

[0047] 4) The ingot is hot forged at 850°C to open the embryo;

[0048] 5) The hot forged sample is hot rolled into a 3.2mm thick plate at 900°C;

[0049] 6) Samples of different shapes are obtained by wire cutting from the plate, and the cut samples are solution treated at 850°C for 2 hours and then air-cooled;

[0050] 7) After the above solution treatment, the sample was deformed at -40°C, and the thickness of the sample increased to 5.1 mm after def...

Embodiment 2

[0053] A method for preparing an alloy with negative thermal expansion, comprising the following steps:

[0054] 1) Weigh block raw materials according to atomic percentage Ni47.2, Ti44.1 and Nb9 respectively. Among them, the purity of Ni and Nb is greater than 99.9%, and the purity of Ti is greater than 99.8%;

[0055] 2) A certain ratio of raw materials is smelted 4 times in a water-cooled copper crucible to obtain an ingot weighing about 15kg;

[0056] 3) Vacuum homogenization annealing of the ingot at 950°C for 6 hours;

[0057] 4) The ingot is hot forged at 900°C to open the blank;

[0058] 5) The hot-forged sample is hot-rolled at 900°C into a plate with a thickness of 4.2mm;

[0059] 6) Samples of different shapes are obtained by wire cutting from the plate, and the cut samples are solution treated at 850°C for 3 hours and then water-cooled;

[0060] 7) After the above solid solution treatment, the sample is subjected to deformation treatment at -35°C, and the thick...

Embodiment 3

[0063] A method for preparing an alloy with negative thermal expansion, comprising the following steps:

[0064] 1) Weigh block raw materials according to atomic percentage Ni47, Ti44 and Nb9 respectively. Among them, the purity of Ni and Nb is greater than 99.9%, and the purity of Ti is greater than 99.8%;

[0065] 2) A certain ratio of raw materials is smelted 4 times in a water-cooled copper crucible to obtain an ingot weighing about 15kg;

[0066] 3) The cast ingot was homogenized and annealed in vacuum at 900°C for 6 hours;

[0067] 4) The ingot is hot forged at 900°C to open the embryo;

[0068] 5) The hot-forged sample is hot-rolled at 900°C into a plate with a thickness of 4.2mm;

[0069] 6) Samples of different shapes are obtained by wire cutting from the plate, and the cut samples are solution treated at 850°C for 3 hours and then water-cooled;

[0070] 7) After the above solution treatment, the sample was deformed at -40°C, and the thickness of the sample increa...

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Abstract

The invention discloses negative expansion memory alloy and a preparation method thereof. The negative expansion memory alloy is NiTiNb memory alloy, and the NiTiNb memory alloy comprises the elementsof 45.5-48.5% of Ni, 42.5-46.5% of Ti, 6.5-10.5% of Nb and the balance impurities. The NiTiNb memory alloy can achieve negative expansion with the temperature range of 290-430 K, the temperature range covers the main service temperature range of a current metal component, the problems that traditional metal components are heated to expand under the service environment and accordingly fails due tomutual extrusion are effectively solved, and the stability and reliability of the traditional metal components in the service proves are improved.

Description

technical field [0001] The invention relates to the field of shape memory alloys, in particular to a negative expansion memory alloy and a preparation method thereof. Background technique [0002] Thermal expansion is the main factor that weakens the dimensional stability and service life of metal components during service. At present, rubber materials are mainly used in engineering applications to offset thermal expansion, so as to avoid the problem of metal components thermally expanding, mutual extrusion and failure. However, in some specific service environments (such as under strong radiation conditions), rubber materials are not suitable. In recent years, researchers at home and abroad have done a lot of work on how to obtain negative expansion metal materials, and have developed negative expansion alloys such as MnNiGe and MnCoGe. Unfortunately, a series of problems such as complex preparation process, low controllability of the temperature range and small negative ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C19/03C22C1/02C22F1/10
CPCC22C1/023C22C19/03C22F1/006C22F1/10
Inventor 杨琴王英英葛继强孙明艳范啟超张永皞陈捷黄姝珂
Owner INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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