A process of cyanide-free gold plating after nickel plating of electronic components and parts

A technology for cyanide-free gold plating of electronic components, which is applied in the technical field of cyanide-free gold plating of electronic components after nickel-plating as a primer, can solve problems such as poor bonding force of gold plating and difficulty in meeting the requirements of coating performance, so as to improve production efficiency and reduce The number of times of solution replenishment and the effect of improving the efficiency of wastewater treatment

Active Publication Date: 2021-02-02
贵州振华群英电器有限公司(国营第八九一厂)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current process has the problem that the cyanide-free gold plating process has poor gold plating adhesion on the nickel layer, and the coating performance is difficult to meet the requirements.

Method used

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  • A process of cyanide-free gold plating after nickel plating of electronic components and parts
  • A process of cyanide-free gold plating after nickel plating of electronic components and parts
  • A process of cyanide-free gold plating after nickel plating of electronic components and parts

Examples

Experimental program
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Effect test

Embodiment 1

[0050] A process for cyanide-free gold plating of electronic components after nickel-plating as a backing, comprising the following steps:

[0051] ①Take electronic components, soak them in 30% hydrochloric acid, rinse them with tap water for 45s, clean them, and chemically polish them at room temperature for 3 minutes. Soak in 12% sodium bicarbonate solution for 15s to neutralize, then wash with tap water for 45s, shake off excess water, soak in distilled alcohol for 12s, and dry at 100-110°C for 30 minutes;

[0052] ② Clamp the electrical components processed in step ① in a conductive fixture, wash with tap water for 45s, and electrolytically degrease. The electrolytic degreasing is; at a current density of 4A / dm 2 , the temperature is 60-80°C, the forward time is 2min, the reverse time is 1min, followed by 80-90°C hot water washing for 45s, tap water washing 3 times;

[0053] ③ Soak the electrical components treated in step ② with 18% analytically pure hydrochloric acid fo...

Embodiment 2

[0061] A process for cyanide-free gold plating of electronic components after nickel-plating as a backing, comprising the following steps:

[0062] ① Take electronic components, soak them in 30% hydrochloric acid, rinse them with tap water for 60 seconds, and then chemically polish them at room temperature for 3 minutes. Soak in 15% sodium bicarbonate solution for 20s to neutralize, then wash with tap water for 60s, shake off excess water, soak in distilled alcohol for 15s, and dry at 100-110°C for 35 minutes;

[0063] ② Clamp the electrical components processed in step ① in a conductive fixture, wash with tap water for 60s, and electrolytically degrease. The electrolytic degreasing is; at a current density of 5A / dm 2 , the temperature is 60-80°C, the forward time is 2min, the reverse time is 1min, followed by 80-90°C hot water washing for 60s, tap water washing 5 times;

[0064] ③ Soak the electrical components treated in step ② with 20% analytically pure hydrochloric acid f...

Embodiment 3

[0072] A process for cyanide-free gold plating of electronic components after nickel-plating as a backing, comprising the following steps:

[0073]①Take electronic components, soak them in 30% hydrochloric acid, rinse them with tap water for 30 seconds, clean them, and chemically polish them at room temperature for 2 minutes. Soak in 10%% sodium bicarbonate solution for 10s to neutralize, then wash with tap water for 30s, shake off excess water, soak in distilled alcohol for 10s, and dry at 100-110°C for 25 minutes;

[0074] ② Clamp the electrical components processed in step ① in a conductive fixture, wash with tap water for 30s, and electrolytically degrease. The electrolytic degreasing is; at a current density of 3A / dm 2 ,Temperature 60-80℃, forward time 2min, reverse time 1min, then wash with hot water at 80-90℃ for 30s, wash with tap water twice;

[0075] ③ Soak the electrical components treated in step ② with 15% analytically pure hydrochloric acid for 10s, move left an...

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Abstract

The invention provides a process for cyanide-free gold plating of electronic components and parts after nickel-plating as a backing, which includes taking electronic components, soaking them in hydrochloric acid, cleaning, chemical polishing, cleaning, neutralization, clamping, cleaning, and degreasing; Activation, cleaning with deionized water; impact nickel plating, impact nickel plating temperature is (10~30)℃, current density is (1~8)A / dm 2 ; Nickel plating, nickel plating temperature is (40 ~ 55) ℃, current density is (0.1 ~ 1) A / dm 2 ; Recycling, cleaning with deionized water, activation; gold plating (charged lower tank), gold plating temperature is (38 ~ 45) ℃, current density is (0.1 ~ 0.3) A / dm 2 ; Recycling, cleaning with deionized water, unloading, dehydration, drying; heat treatment, post-processing, that is all. In the process of the invention, the gold-plated layer on the nickel-plated layer has good bonding force and good coating performance.

Description

technical field [0001] The invention relates to a cyanide-free gold-plating process for electronic components after nickel-plating as a primer, which solves the problem of the binding force of the cyanide-free gold-plating after general nickel-plating as a primer. Background technique [0002] As the lead-out pins of high-reliability electronic components, the base has been cyanide-plated with silver, and then cyanide-plated with gold. With the continuous expansion of requirements in the aerospace field, especially the continuous upgrading of aerospace product quality requirements, the plating requirements of high-reliability product pins are gradually referred to the US MIL standard, which must be nickel-plated and gold-plated. [0003] The adjustment of the national industrial policy, the comprehensive implementation of clean production, and the requirements of ensuring green ecological development, domestic gold plating and silver plating have all carried out research and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/14C25D3/12C25D3/48
CPCC25D3/12C25D3/48C25D5/14
Inventor 王思醇刘春涛杨琼
Owner 贵州振华群英电器有限公司(国营第八九一厂)
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