A process method for composite asynchronous polishing of ceramics by picosecond-nanosecond laser

一种皮秒激光、工艺方法的技术，应用在激光焊接设备、制造工具、金属加工设备等方向，能够解决材料去除量多、表面形貌易破坏、热/机械应力影响区大等问题，达到熔点低、表面活性大的效果

Active Publication Date: 2020-04-14
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problems of microcracks and pores, large thermal / mechanical stress affected area, large amount of material removal and easy damage of surface morphology in the existing ceramic material polishing technology, the invention provides a picosecond-nanosecond laser composite asynchronous The technical solution for polishing ceramics can effectively overcome the above-mentioned problems and realize the high-precision sub-micron polishing effect without destroying the geometric shape of the material surface.

Method used

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  • A process method for composite asynchronous polishing of ceramics by picosecond-nanosecond laser
  • A process method for composite asynchronous polishing of ceramics by picosecond-nanosecond laser
  • A process method for composite asynchronous polishing of ceramics by picosecond-nanosecond laser

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Embodiment 1

[0023] To polish the 95% alumina ceramic substrate, first use the picosecond laser with an average power of 60W, a repetition rate of 100,000KHz, and a defocus of 0 to start scanning irradiation, with a scanning speed of 400mm / s and a scanning path gap of 0.05mm. Sputtering used to remove material microscopic surface protrusions and excite micro-nano particles. After 50μs, the average power is 5W, the repetition frequency is 100KHz, and the nanosecond laser with a defocus of +0.3mm tracks the picosecond laser scanning path to irradiate at the same speed, which is used to melt the micro-nano particles produced by picosecond laser irradiation. It produces a layer of uniform and dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface microscopic appearance was tested by laser confocal microscope. The roughness Ra decreased from the original 1.70 μm to 0.68 μm. The three-dimensional appearance of the surface before and...

Embodiment 2

[0025] To polish the zirconia ceramic substrate, first use a picosecond laser with an average power of 30W, a repetition rate of 50,000KHz, and a defocus of 0 to start scanning irradiation. The scanning speed is 1000mm / s, and the scanning path gap is 0.01mm. , for sputtering to remove material microscopic surface protrusions and excite micro-nano particles. After 50μs, start the nanosecond laser with an average power of 3W, a repetition rate of 50KHz, and a defocus of +0.5mm to track the picosecond laser scanning path to irradiate at the same speed, which is used to melt the micro-nano particles produced by picosecond laser irradiation, so that It produces a uniform dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface micro-morphology was tested using a laser confocal microscope. The roughness Ra decreased from the original 1.30 μm to 0.52 μm. The three-dimensional surface morphology before and after polishing i...

Embodiment 3

[0027]To polish the aluminum nitride ceramic substrate, first use a picosecond laser with an average power of 55W, a repetition rate of 100,000KHz, and a defocus of 0 to start scanning irradiation, with a scanning speed of 300mm / s and a scanning path gap of 0.5mm. Sputtering used to remove material microscopic surface protrusions and excite micro-nano particles. After 100μs, the average power is 14W, the repetition frequency is 100KHz, and the nanosecond laser tracking picosecond laser scanning path is irradiated at the same speed with a defocus of +0.1mm, which is used to melt the micro-nano particles produced by picosecond laser irradiation, so that It produces a uniform dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface micromorphology was tested using a laser confocal microscope. The roughness Ra dropped from the original 1.81 μm to 0.65 μm.

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Abstract

The invention discloses a picosecond-nanosecond laser composite asynchronous polishing process for ceramics. First, the picosecond laser is used to irradiate the surface of the ceramic to be processed along a certain scanning track, and remove the microscopic protrusions on the ceramic surface to achieve preliminary flatness. At the same time, the removal of the electronic state of the ceramic material by the picosecond laser induces a large number of micro-nano particles, which exist in the adjacent spatial region of the irradiated ceramic surface in an ionized state. Start the low-power nanosecond laser at the preset time to trace the picosecond laser scanning path, irradiate and melt the micro-nano particles evenly distributed on the ceramic surface, and finally form a dense and smooth fine-grain fused layer to achieve the polishing effect. The invention repairs the original pore cracks of ceramic materials, overcomes the disadvantages of large heat-affected zone caused by traditional laser polishing, and easily produces micro-cracks and pores on the material surface, and realizes low removal of ceramic materials, high efficiency and high precision sub-micron level fineness polishing.

Description

technical field [0001] The invention relates to the field of laser polishing on the surface of ceramic materials, in particular to a submicron level high-precision laser composite polishing processing method on the surface of alumina ceramics. [0002] technical background [0003] Alumina (Al 2 o 3 ), zirconia (ZrO 2 ) as the main ceramic material, used for thick film integrated circuits and ceramic structural parts. Engineering ceramics such as alumina and zirconia have good conductivity, mechanical strength and high temperature resistance. They are widely used ceramics. Use and special performance needs. However, the conventional mechanical polishing method for ceramic materials has long processing time and low processing efficiency, and most of the mechanical processing is contact processing, which is easy to cause mechanical damage to the ceramic surface, subsurface cracks and other defects, and mechanical processing is limited by its processing principle and is diff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00
CPCB23K26/0006B23K26/0604B23K26/0626B23K26/0624B23K26/082B23K26/60B23K2103/52B23K26/354
Inventor 季凌飞张熙民王文豪燕天阳马瑞
Owner BEIJING UNIV OF TECH
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